公开(公告)号：US20240215157A1

公开(公告)日：2024-06-27

申请号：US18382202

申请日：2023-10-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ki Ran PARK ,  Hyun Woo KWON ,  Tae Hong MIN ,  Sang Hyun HAN ,  Guh Hwan LIM ,  Yo Han SONG ,  Dong Keun LEE ,  Kyeong Yub JUNG ,  Eun Gyu JEONG ,  Yu Mi KIM

IPC: H05K1/02 ,  H05K3/10 ,  H05K3/42

CPC classification number: H05K1/0298 ,  H05K3/108 ,  H05K3/425 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2203/072 ,  H05K2203/0723

Abstract: A printed circuit board includes: a first insulating layer; a via pad disposed on an upper surface of the first insulating layer; a second insulating layer disposed on the upper surface of the first insulating layer and having a via hole exposing at least a portion of an upper surface of the via pad; a conductor pattern disposed on the exposed upper surface of the via pad; and a via including a first metal layer covering at least a portion of each of a wall surface of the via hole, the exposed upper surface of the via pad, and the conductor pattern, and a second metal layer disposed on the first metal layer and disposed in at least a portion of the via hole.

公开(公告)号：US20230199976A1

公开(公告)日：2023-06-22

申请号：US17726896

申请日：2022-04-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Guh Hwan LIM ,  Chi Seong KIM ,  Won Seok LEE ,  Jin Oh PARK ,  Yu Mi KIM ,  Sang Yun LEE ,  Eun Sun KIM

IPC: H05K3/46 ,  H05K3/40 ,  H05K1/11

CPC classification number: H05K3/4697 ,  H05K3/4038 ,  H05K3/4644 ,  H05K1/115 ,  H05K2201/09036

Abstract: A printed circuit board includes a first insulating layer having a through cavity and containing an insulating material. A length between one side surface and the other side surface opposite to the one side surface of the through cavity is greater than a thickness of the first insulating layer, and the first insulating layer includes a recess located in each of an upper edge and a lower edge of the one side surface of the through cavity.