MEMORY DEVICE INCLUDING BUMP ARRAYS SPACED APART FROM EACH OTHER AND ELECTRONIC DEVICE INCLUDING THE SAME

    公开(公告)号:US20190259732A1

    公开(公告)日:2019-08-22

    申请号:US16115741

    申请日:2018-08-29

    Abstract: A memory device includes a buffer die including a first bump array and a second bump array spaced apart from each other in a first direction parallel to a lower surface of the buffer die; a first memory die stacked on the buffer die through a plurality of first through silicon vias and including banks; and a second memory die stacked on the first memory die by a plurality of second through silicon vias and including banks, wherein the first bump array is provided for a first channel to communicate between the first and second memory dies and a first processor, wherein the second bump array is provided for a second channel to communicate between the first and second memory dies and a second processor, and wherein the first channel and the second channel are independent of each other such that banks allocated to the first channel are accessed only by the first processor not the second processor through the first channel and banks allocated to the second channel are accessed only by the second processor not the first processor through the second channel.

    MEMORY SYSTEM, A METHOD OF DETERMINING AN ERROR OF THE MEMORY SYSTEM AND AN ELECTRONIC APPARATUS HAVING THE MEMORY SYSTEM

    公开(公告)号:US20190235977A1

    公开(公告)日:2019-08-01

    申请号:US16200948

    申请日:2018-11-27

    CPC classification number: G06F11/201 G06F11/073 G06F11/0751 G06F2201/805

    Abstract: A memory system including: a memory apparatus including a buffer die, core dies disposed on the buffer die, channels and a through silicon via configured to transmit a signal between the buffer die and at least one of the core dies; a memory controller configured to output a command signal and an address signal to the memory apparatus, to output a data signal to the memory apparatus and to receive the data signal from the memory apparatus; and an interposer including channel paths for connecting the memory controller and the channels, wherein the memory apparatus further includes a path selector for changing a connection state between the channels and channel paths, and when an error is detected in a first connection state between the channels and the channel paths, the path selector changes the first connection state to a second connection state.

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