公开(公告)号：US09628048B2

公开(公告)日：2017-04-18

申请号：US14327151

申请日：2014-07-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kuang-woo Nam ,  In-sang Song ,  Chul-soo Kim ,  Yun-kwon Park ,  Eun-seok Park

IPC: H03H9/70 ,  H03H9/72 ,  H03H9/46 ,  H03H9/10 ,  H03H9/54 ,  H03H9/64 ,  H03H3/02 ,  H03H3/08 ,  H03H3/007

CPC classification number: H03H9/46 ,  H03H3/02 ,  H03H3/08 ,  H03H9/105 ,  H03H9/1092 ,  H03H9/54 ,  H03H9/64 ,  H03H9/703 ,  H03H9/706 ,  H03H9/72 ,  H03H9/725 ,  H03H2003/0071 ,  Y10T29/42

Abstract: A method of fabricating a multi-band filter module is provided. The method includes forming a Film Bulk Acoustic Resonator (FBAR) on a piezoelectric substrate by forming a resonant part on the piezoelectric substrate and then an air gap recessed on a surface of the piezoelectric substrate and positioned under the resonant part; and forming a Surface Acoustic Wave (SAW) device on the piezoelectric substrate in which the steps of forming the FBAR and the SAW are concurrently performed.