公开(公告)号：US20240098912A1

公开(公告)日：2024-03-21

申请号：US18373776

申请日：2023-09-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinhwan JEON ,  Kwangho Jung ,  Chihyun Cho ,  Sangwon Ha

IPC: H05K5/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34

CPC classification number: H05K5/0069 ,  H05K1/111 ,  H05K1/181 ,  H05K3/0044 ,  H05K3/284 ,  H05K3/341 ,  H05K5/0086 ,  H05K2201/09372 ,  H05K2201/10007

Abstract: An electronic device includes a housing, a circuit board disposed within the housing, a first component and a second component disposed on one surface of the circuit board, a shielding mold disposed on the one surface of the circuit board to cover top and side surfaces of the first component, and an open structure disposed on the one surface of the circuit board to surround a side surface of the second component. In the open structure, a top portion is opened and exposes a part of the second component or the circuit board, an inner surface is spaced apart from the second component, and an outer surface contacts the shielding mold.

公开(公告)号：US20240306354A1

公开(公告)日：2024-09-12

申请号：US18666570

申请日：2024-05-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwangho JUNG ,  Yongwon LEE ,  Jaeheung YE ,  Jinhwan JEON

IPC: H05K9/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K9/0024 ,  H05K1/0218 ,  H05K1/18 ,  H05K2201/10189 ,  H05K2201/10242

Abstract: An electronic device according to an embodiment includes a printed circuit board including a conductive layer and a conductive pad connected to the conductive layer and exposed to an outside of the printed circuit board; an electric component disposed on a first region of the printed circuit board and the electric component electrically connected to the printed circuit board; a conductive member disposed on the conductive pad and the conductive member surrounding at least part of a periphery of the first region of the printed circuit board; and a shielding member isolating the first region of the printed circuit board from the outside of the printed circuit board by covering the electric component and the conductive member, the shielding member electrically connected to the conductive layer. In addition, various embodiments are possible.

公开(公告)号：US20240244748A1

公开(公告)日：2024-07-18

申请号：US18620132

申请日：2024-03-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinhwan JEON

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K1/111 ,  H05K1/142 ,  H05K2201/10378

Abstract: The disclosure relates to a printed circuit board (PCB) module and an electronic apparatus comprising same. A PCB module is provided. The PCB includes a board including a first surface facing a first direction and having formed thereon a first pad for electrical connection with the board, and a second surface facing a second direction opposite to the first direction and having formed thereon the first pad for electrical connection with the board and a second pad for bonding a shielding member thereto, and at least one component disposed on the second surface, wherein the PCB module may be configured to bonded to an adjacent board by using the first pad formed on the first surface or the second surface.

公开(公告)号：US20230130560A1

公开(公告)日：2023-04-27

申请号：US17974433

申请日：2022-10-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinhwan JEON

IPC: H05K1/18 ,  H05K7/14 ,  H05K1/14 ,  H05K1/02 ,  H05K1/11

Abstract: An electronic device may include a housing, a first printed circuit board being disposed in the housing and including a receiving space formed in at least a portion thereof, and a second printed circuit board being stacked (directly or indirectly) on at least a partial area of the first printed circuit board, the second printed circuit board including a first surface including a plurality of pads configured to be electrically connected with the first printed circuit board and a second surface facing in a direction opposite to the first surface. Other various embodiments are possible.