公开(公告)号：US20220146078A1

公开(公告)日：2022-05-12

申请号：US17379530

申请日：2021-07-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongsoo LIM ,  Chinwoo KIM ,  Yongchul KANG ,  Heejin KIM ,  Jeongje MOON ,  Jaeyoo JEONG ,  Jun CHO ,  Jongwook JU

IPC: F21V14/00 ,  F21V33/00

Abstract: Provided is a light source module including a package body having a groove portion, a semiconductor light emitting diode (LED) chip provided on a bottom surface of the groove portion, the semiconductor LED chip being configured to emit light based on a first driving voltage applied thereto, a variable light transmission unit provided on the groove portion and having light transmissivity varying based on a second driving voltage applied thereto, a first electrode side surface and a second electrode side surface provided on side surfaces of the groove portion and connecting the bottom surface of the groove portion to the variable light transmission unit, and a processor configured to control application of the first driving voltage to the semiconductor LED chip and the second driving voltage to the variable light transmission unit.

公开(公告)号：US20230197701A1

公开(公告)日：2023-06-22

申请号：US17948298

申请日：2022-09-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongsoo LIM ,  Chinwoo KIM ,  Jeongje MOON ,  Jaeyoo JEONG ,  Jun CHO ,  Yongchul KANG ,  Jongwook JU

IPC: H01L25/16 ,  H01L33/62 ,  H01L33/60 ,  H01L31/02 ,  G03B15/06 ,  G03B15/05 ,  H04M1/22 ,  H04N5/225 ,  H04M1/02

CPC classification number: H01L25/167 ,  H01L33/62 ,  H01L33/60 ,  H01L31/02005 ,  H01L25/165 ,  G03B15/06 ,  G03B15/05 ,  H04M1/22 ,  H04N5/2256 ,  H04M1/0264 ,  H01L31/09

Abstract: A flash light emitting diode (LED) package includes a circuit board, a flash LED device disposed on an upper surface of the circuit board n, first and third optical sensors arranged to be adjacent to a first side of the flash LED device on the upper surface of the circuit board and configured to detect light of a first wavelength and light of a second wavelength, respectively, second and fourth optical sensors arranged to be adjacent to a second side of the flash LED device on the upper surface of the circuit board and configured to detect light of the first wavelength and light of the second wavelength, respectively, and an integrated circuit (IC) chip disposed to face a third side between the first and second sides of the flash LED device on the upper surface of the circuit board.