公开(公告)号：US20230133634A1

公开(公告)日：2023-05-04

申请号：US17886208

申请日：2022-08-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seolyoung CHOI ,  Sun KIM ,  Kyoungjun KIM ,  Junghun LEE

IPC: H01L33/64 ,  H01L33/60 ,  H01L33/62

Abstract: A semiconductor light emitting device package includes: a ceramic substrate having first and second electrode structures; a light emitting diode chip mounted on the ceramic substrate, electrically connected to the first and second electrode structures, and configured to emit ultraviolet light; metal patterns disposed on the ceramic substrate to be spaced apart from the first and second electrode structures; an adhesive pattern disposed on the ceramic substrate between the adjacent metal patterns, the adhesive pattern having both side surfaces in contact with one side surface of the metal patterns and an upper surface positioned on a level below that of a lower surface of the light emitting diode chip; and a protector attached to the ceramic substrate by the adhesive pattern, the protector providing a cavity surrounding the light emitting diode chip.

公开(公告)号：US20210242118A1

公开(公告)日：2021-08-05

申请号：US17060248

申请日：2020-10-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongsup SONG ,  Seolyoung CHOI

IPC: H01L23/498 ,  H01L25/16 ,  H01L23/00 ,  H01L23/13 ,  H01L23/367 ,  H01S5/022 ,  H05K1/11 ,  H05K1/18 ,  H01S5/024

Abstract: A wiring board includes: a metal plate having first and second surfaces opposite to each other, and having at least one through-hole penetrating through the first and second surfaces; at least one conductive via respectively disposed in the through-hole and spaced apart from the metal plate; an insulating structure including at least one through-insulating portion disposed between the through-hole and the conductive via, and a first insulating layer and a second insulating layer extending from the through-insulating portion and disposed in first regions surrounding the conductive via, on the first surface and the second surface, respectively; at least one first upper pad disposed on the first insulating layer and electrically connected to the conductive via; at least one first lower pad disposed on the second insulating layer and electrically connected to the conductive via; a second upper pad disposed on the first surface of the metal plate; and a second lower pad disposed on the second surface of the metal plate and electrically connected to the first upper pad through the metal plate.