公开(公告)号：US20200333827A1

公开(公告)日：2020-10-22

申请号：US16917912

申请日：2020-07-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chan KWAK ,  Jae-Young CHOI ,  Kwang Hee KIM ,  Jong Wook ROH ,  Hyeon Cheol PARK ,  Weon Ho SHIN ,  Yun Sung WOO ,  Hyosug LEE ,  Jinyoung HWANG

IPC: G06F1/16 ,  G06F3/044 ,  G06F3/041 ,  H05K1/02 ,  H05K1/09

Abstract: An electrode structure includes: a first nonconductive layer; a first conductive layer disposed on the first nonconductive layer; a second nonconductive layer disposed on the first conductive layer; a second conductive layer disposed on the second nonconductive layer; and a third nonconductive layer disposed on the second conductive layer, where at least one of the first conductive layer and the second conductive layer includes a two-dimensional conductive material.

公开(公告)号：US20160018845A1

公开(公告)日：2016-01-21

申请号：US14802599

申请日：2015-07-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chan KWAK ,  Jae-Young CHOI ,  Kwang Hee KIM ,  Jong Wook ROH ,  Hyeon Cheol PARK ,  Weon Ho SHIN ,  Yun Sung WOO ,  Hyosug LEE ,  Jinyoung HWANG

IPC: G06F1/16 ,  H05K1/02 ,  H05K1/09 ,  G06F3/041

CPC classification number: G06F1/16 ,  G06F3/0416 ,  G06F3/044 ,  G06F2203/04103 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/09

Abstract: An electrode structure includes: a first nonconductive layer; a first conductive layer disposed on the first nonconductive layer; a second nonconductive layer disposed on the first conductive layer; a second conductive layer disposed on the second nonconductive layer; and a third nonconductive layer disposed on the second conductive layer, where at least one of the first conductive layer and the second conductive layer includes a two-dimensional conductive material.

Abstract translation: 电极结构包括：第一非导电层; 设置在所述第一非导电层上的第一导电层; 设置在所述第一导电层上的第二非导电层; 设置在所述第二非导电层上的第二导电层; 以及设置在第二导电层上的第三非导电层，其中第一导电层和第二导电层中的至少一个包括二维导电材料。

公开(公告)号：US20140345919A1

公开(公告)日：2014-11-27

申请号：US14095005

申请日：2013-12-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Se Yun KIM ,  Eun Sung LEE ,  Keum Hwan PARK ,  Weon Ho SHIN ,  Suk Jun KIM ,  Jin Man PARK ,  Sang Soo JEE

IPC: H05K1/02 ,  H05K1/09 ,  H01B13/00 ,  H01B1/16 ,  H01B1/02

CPC classification number: H05K1/09 ,  H01B1/16 ,  H01L31/02167 ,  H01L31/022466 ,  H01L31/022491 ,  H05K1/0289 ,  H05K1/092 ,  H05K3/101 ,  H05K3/1216 ,  H05K3/1275 ,  H05K2201/0108 ,  Y02E10/50

Abstract: A transparent conductor includes a metallic glass, and a method of manufacturing a transparent conductor includes: preparing a metallic glass or a mixture comprising the metallic glass; and firing the metallic glass or the mixture comprising the metallic glass at a predetermined temperature higher than a glass transition temperature of the metallic glass.

Abstract translation: 透明导体包括金属玻璃，并且制造透明导体的方法包括：制备金属玻璃或包含金属玻璃的混合物; 并且在高于金属玻璃的玻璃化转变温度的预定温度下烧制金属玻璃或包含金属玻璃的混合物。