公开(公告)号：US20200168518A1

公开(公告)日：2020-05-28

申请号：US16681341

申请日：2019-11-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngkwan LEE ,  Youngsik Hur ,  Taehee Han ,  Yonghoon Kim ,  Yuntae Lee

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/00

Abstract: A semiconductor package includes: a frame having a cavity and including a wiring structure connecting first and second surfaces of the frame; a first connection structure on the first surface of the frame and including a first redistribution layer connected to the wiring structure; a first semiconductor chip on the first connection structure within the cavity; an encapsulant encapsulating the first semiconductor chip and covering the second surface of the frame; a second connection structure including a second redistribution layer including a first redistribution pattern and first connection vias; and a second semiconductor chip disposed on the second connection structure and having connection pads connected to the second redistribution layer.

公开(公告)号：US20200219833A1

公开(公告)日：2020-07-09

申请号：US16704217

申请日：2019-12-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngkwan LEE ,  Youngsik HUR ,  Junghyun Cho ,  Taehee Han ,  Jongrok Kim

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: A semiconductor package may include: a connection structure including an insulating member having a first surface having a recess portion and a second surface opposing the first surface, a plurality of first pads disposed on a bottom surface of the recess portion, a plurality of second pads embedded in the second surface of the insulating member, and a redistribution layer disposed between the plurality of first pads and the plurality of second pads and connected to the plurality of first and second pads; a semiconductor chip disposed on the first surface of the insulating member and having a plurality of connection electrodes electrically connected, respectively, to the plurality of first pads; and a passivation layer disposed on the second surface of the insulating member and having a plurality of openings exposing, respectively, the plurality of second pads.

公开(公告)号：US20230341776A1

公开(公告)日：2023-10-26

申请号：US18106254

申请日：2023-02-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HOYOUNG KIM ,  Youngkwan LEE ,  SOOCHAN KIM ,  Hyungjun CHEE ,  HYUNWOO KIM ,  SONGSE YI

IPC: G03F7/06 ,  C07F1/00

CPC classification number: G03F7/06 ,  C07F1/005

Abstract: A resist compound is represented by Formula 1:




wherein R1 is an alkyl group having 1 to 12 carbon atoms, an alkenyl group having 1 to 12 carbon atoms, or a hydrocarbon ring group having 3 to 12 carbon atoms, and A bonded to R1 is O or NR2, wherein R2 is hydrogen, an alkyl group having 1 to 12 carbon atoms, an alkenyl group having 1 to 12 carbon atoms, or a hydrocarbon ring group having 3 to 12 carbon atoms. A resist composition includes the resist compound and an organic solvent. A method for forming a resist pattern includes forming a resist layer by applying the resist composition including the resist compound on a substrate, irradiating light onto the resist layer to provide an irradiated resist layer, and developing the irradiated resist layer to form a resist pattern.

公开(公告)号：US20200185321A1

公开(公告)日：2020-06-11

申请号：US16684808

申请日：2019-11-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngkwan LEE ,  Youngsik HUR ,  Taehee HAN

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00

Abstract: A semiconductor package includes a core layer formed of a ferromagnetic material, and includes a frame passing through the core layer and having a through-hole, a semiconductor chip disposed in the through-hole of the frame, and having an active surface on which a connection pad is disposed, and an inactive surface opposite to the active surface, an encapsulant covering at least a portion of the semiconductor chip, and a first connection structure including a first redistribution layer disposed on the active surface of the semiconductor chip and electrically connected to the connection pad.