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公开(公告)号：US20250096186A1
公开(公告)日：2025-03-20
申请号：US18970353
申请日：2024-12-05
Applicant: SAMSUNG ELECTRONICS CO.,LTD.
Inventor： Chagyu SONG , Hoyeon Seo , Jaeyeon Ra , Kookjin Park , Chulwoo Park , Dongjun Shin , Jongbum Lee , Gyeongmin Jin
Abstract: An electronic device may be provided and include: a printed circuit board includes a first side and a second side perpendicular to the first side; a plurality of solder balls on a surface of the printed circuit board and spaced apart from the first side and the second side; an electronic component including at least one circuit, the electronic component on at least some of the plurality of solder balls; a resin along the first side and filling a portion of a space between the surface of the printed circuit board and the electronic component; and a blocking structure in or on the surface of the printed circuit board, the blocking structure being between the plurality of solder balls and the first side, and extending along the first side such as to separate the at least some of the plurality of solder balls from the resin.
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公开(公告)号：US12279371B2
公开(公告)日：2025-04-15
申请号：US17886327
申请日：2022-08-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Gyeongmin Jin , Jichul Kim , Yongjae Song , Jaeyeon Ra , Chagyu Song
Abstract: Disclosed is a printed circuit board assembly comprising: a first printed circuit board; a second printed circuit board stacked with the first printed circuit board; and an interposer arranged between the first printed circuit board and the second printed circuit board, wherein the second printed circuit board includes a first part and a second part extending in a first direction from a part of the first part and wherein a length of the second part in a second direction perpendicular to the first direction is less than a length in the second direction of the first part, and wherein the direction of a first conductive pattern formed on the first part and the direction of a second conductive pattern formed on the second part are substantially perpendicular to each other.
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公开(公告)号：US11516917B2
公开(公告)日：2022-11-29
申请号：US17172351
申请日：2021-02-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junghoon Park , Younggirl Yun , Sunggeun Kang , Myungsub Ko , Jaeyeon Ra , Seungbo Shim , Yongjin Woo , Junhee Han
Abstract: An electronic device includes a processor and a printed circuit board on which the processor is mounted. The printed circuit board includes a first circuit board, a first interposer formed on a first portion of the first circuit board, a second interposer formed on a second portion of the first circuit board that is adjacent to the first portion, a second circuit board coupled to the first interposer, and a third circuit board coupled to the second interposer.
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公开(公告)号：US20210251079A1
公开(公告)日：2021-08-12
申请号：US17172351
申请日：2021-02-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junghoon PARK , Younggirl Yun , Sunggeun Kang , Myungsub Ko , Jaeyeon Ra , Seungbo Shim , Yongjin Woo , Junhee Han
Abstract: An electronic device includes a processor and a printed circuit board on which the processor is mounted. The printed circuit board includes a first circuit board, a first interposer formed on a first portion of the first circuit board, a second interposer formed on a second portion of the first circuit board that is adjacent to the first portion, a second circuit board coupled to the first interposer, and a third circuit board coupled to the second interposer.
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