公开(公告)号：US20190187553A1

公开(公告)日：2019-06-20

申请号：US15845456

申请日：2017-12-18

Applicant: SANDISK TECHNOLOGIES LLC

Inventor： Daniel J. Linnen ,  Jianhua Zhu ,  Srikar Peesari ,  Kirubakaran Periyannan ,  Avinash Rajagiri ,  Shantanu Gupta ,  Jagdish Sabde ,  Ashish Ghai ,  Deepak Bharadwaj

IPC: G03F1/50

CPC classification number: G03F1/50

Abstract: An apparatus is provided that includes a reticle including a die, the reticle configured to increase a number of partial die that can be successfully used as partially operable die.