Abstract:
An apparatus is provided that includes a reticle including a die, the reticle configured to increase a number of partial die that can be successfully used as partially operable die.
Abstract:
Techniques are presented for testing the high-speed data path between the IO pads and the read/write buffer of a memory circuit without the use of an external test device. In an on-chip process, a data test pattern is transferred at a high data rate between the read/write register and a source for the test pattern, such as register for this purpose or the read/write buffer of another plane. The test data after the high-speed transfer is then checked against its expected, uncorrupted value, such as by transferring it back at a lower speed for comparison or by transferring the test data a second time, but at a lower rate, and comparing the high transfer rate copy with the lower transfer rate copy at the receiving end of the transfers.
Abstract:
A partial memory die is missing one or more components. One example of a partial memory die includes an incomplete memory structure such that the partial memory die is configured to successfully perform programming, erasing and reading of the incomplete memory structure.
Abstract:
A partial memory die comprises a memory structure that includes a first plane of non-volatile memory cells and a second plane of non-volatile memory cells. The second plane of non-volatile memory cells is incomplete. A first buffer is connected to the first plane. A second buffer is connected to the second plane. A data path circuit is connected to an input interface, the first buffer and the second buffer. The data path circuit is configured to map data received at the input interface and route the mapped data to either the first buffer or the second buffer. An inter-plane re-mapping circuit is connected to the first buffer and the second buffer, and is configured to re-map data from the first buffer and store the re-mapped data in the second buffer for programming into the second plane.
Abstract:
Techniques are presented for testing the high-speed data path between the IO pads and the read/write buffer of a memory circuit without the use of an external test device. In an on-chip process, a data test pattern is transferred at a high data rate between the read/write register and a source for the test pattern, such as register for this purpose or the read/write buffer of another plane. The test data after the high-speed transfer is then checked against its expected, uncorrupted value, such as by transferring it back at a lower speed for comparison or by transferring the test data a second time, but at a lower rate, and comparing the high transfer rate copy with the lower transfer rate copy at the receiving end of the transfers.
Abstract:
A number of techniques for determining defects in non-volatile memory arrays are presented, which are particularly applicable to 3D NAND memory, such as that of the BiCS type. Word line to word shorts within a memory block are determined by application of an AC stress mode, followed by a defect detection operation. An inter-block stress and detection operation can be used determine word line to word line leaks between different blocks. Select gate leak line leakage, both the word lines and other select lines, is consider, as are shorts from word lines and select lines to local source lines. In addition to word line and select line defects, techniques for determining shorts between bit lines and low voltage circuitry, as in the sense amplifiers, are presented.
Abstract:
A partial memory die comprises a memory structure that includes a first plane of non-volatile memory cells and a second plane of non-volatile memory cells. The second plane of non-volatile memory cells is incomplete. A first buffer is connected to the first plane. A second buffer is connected to the second plane. A data path circuit is connected to an input interface, the first buffer and the second buffer. The data path circuit is configured to map data received at the input interface and route the mapped data to either the first buffer or the second buffer. An inter-plane re-mapping circuit is connected to the first buffer and the second buffer, and is configured to re-map data from the first buffer and store the re-mapped data in the second buffer for programming into the second plane.
Abstract:
Techniques are presented for the determination defects in non-volatile arrays, particularly those having a 3D or BiCS type of arrangement where NAND strings run in a vertical direction relative to the substrate. In such an arrangement, the NAND strings are formed along memory holes and connected to global bit lines, and are separated into blocks or sub-blocks by vertical local interconnects, such as for source lines, and connected to a corresponding global line. To determine defective blocks, a reference current is determined based on the amount of current drawn by the local interconnects when a high voltage is applied and all of the blocks are de-selected. The amount of leakage current is determined when a selected block is biased to ground and the high voltage is applied to the interconnects. By comparing the reference current to the leakage current, a determination can be made on whether the selected block has defects related to the local interconnect structure.
Abstract:
A number of techniques for determining defects in non-volatile memory arrays are presented, which are particularly applicable to 3D NAND memory, such as that of the BiCS type. Word line to word shorts within a memory block are determined by application of an AC stress mode, followed by a defect detection operation. An inter-block stress and detection operation can be used determine word line to word line leaks between different blocks. Select gate leak line leakage, both the word lines and other select lines, is consider, as are shorts from word lines and select lines to local source lines. In addition to word line and select line defects, techniques for determining shorts between bit lines and low voltage circuitry, as in the sense amplifiers, are presented.
Abstract:
A partial memory die is missing one or more components. One example of a partial memory die includes an incomplete memory structure such that the partial memory die is configured to successfully perform programming, erasing and reading of the incomplete memory structure.