公开(公告)号：US20230215743A1

公开(公告)日：2023-07-06

申请号：US18074454

申请日：2022-12-03

Applicant: SEMES CO., LTD.

Inventor： Young Jin KIM ,  Eunhyeok CHOI ,  Ye Jin CHOI

IPC: H01L21/67 ,  B08B13/00 ,  B08B3/02 ,  H01L21/687

CPC classification number: H01L21/67051 ,  B08B3/022 ,  B08B13/00 ,  H01L21/68764

Abstract: A wafer treatment apparatus includes a wafer supporter for supporting and rotating a wafer, a frontside liquid discharger for discharging a liquid toward a frontside of the wafer, a backside liquid discharger for discharging the liquid toward a backside of the wafer, a treatment chamber for accommodating the wafer supporter, and including liquid collecting inlets stacked on each other and receiving the liquid discharged from at least one of the frontside and backside liquid dischargers, and a controller for controlling a height of an upper end of a first liquid collecting inlet of the liquid collecting inlets to have one of a first height in a process of discharging the liquid to the backside of the wafer adjacent to the wafer supporter and a second height, lower than the first height, in a process of discharging the liquid to the frontside of the wafer.