公开(公告)号：US20230215743A1

公开(公告)日：2023-07-06

申请号：US18074454

申请日：2022-12-03

Applicant: SEMES CO., LTD.

Inventor： Young Jin KIM ,  Eunhyeok CHOI ,  Ye Jin CHOI

IPC: H01L21/67 ,  B08B13/00 ,  B08B3/02 ,  H01L21/687

CPC classification number: H01L21/67051 ,  B08B3/022 ,  B08B13/00 ,  H01L21/68764

Abstract: A wafer treatment apparatus includes a wafer supporter for supporting and rotating a wafer, a frontside liquid discharger for discharging a liquid toward a frontside of the wafer, a backside liquid discharger for discharging the liquid toward a backside of the wafer, a treatment chamber for accommodating the wafer supporter, and including liquid collecting inlets stacked on each other and receiving the liquid discharged from at least one of the frontside and backside liquid dischargers, and a controller for controlling a height of an upper end of a first liquid collecting inlet of the liquid collecting inlets to have one of a first height in a process of discharging the liquid to the backside of the wafer adjacent to the wafer supporter and a second height, lower than the first height, in a process of discharging the liquid to the frontside of the wafer.

公开(公告)号：US20210104420A1

公开(公告)日：2021-04-08

申请号：US17061629

申请日：2020-10-02

Applicant: SEMES CO., LTD.

Inventor： Ye Jin CHOI ,  Daehun KIM ,  Kangseop YUN

IPC: H01L21/67

Abstract: Disclosed is a support unit for supporting a substrate. The support unit includes a support plate having an inner space defined therein, a heating member disposed in the inner space and emitting light for heating the substrate supported on the support unit, and a reflective member disposed along an edge region of the support plate and reflecting thermal energy of the light to an edge region of the substrate supported on the support unit.

公开(公告)号：US20230207355A1

公开(公告)日：2023-06-29

申请号：US18145538

申请日：2022-12-22

Applicant: SEMES CO., LTD.

Inventor： Kun Hee PARK ,  Young Joon HAN ,  Cheol Hwan JEONG ,  Dae Hun KIM ,  Seong Hyun YUN ,  Ye Jin CHOI ,  Eun Hyeok CHOI ,  Tae Ho KANG ,  Young Jin KIM

IPC: H01L21/67 ,  H01L21/687 ,  B08B13/00 ,  B08B3/02 ,  B08B1/00 ,  B08B1/02 ,  B25J15/00 ,  B25J11/00

CPC classification number: H01L21/67207 ,  H01L21/67178 ,  H01L21/67196 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/68764 ,  H01L21/68707 ,  B08B13/00 ,  B08B3/022 ,  B08B1/002 ,  B08B1/02 ,  B25J15/0052 ,  B25J11/0085

Abstract: An apparatus for treating a substrate of the present invention includes a buffer unit, an inversion unit, a first transfer chamber, a second transfer chamber, a first cleaning chamber, and a second cleaning chamber. The first transfer chamber, the inversion unit, and the second transfer chamber are sequentially arranged in one direction. The first cleaning chamber is disposed at one side of the first transfer chamber, and the second cleaning chamber is disposed at one side of the second transfer chamber. A first main transfer robot provided in the first transfer chamber directly transfers the substrate between the buffer unit, the inversion unit, and the first cleaning chamber. The second main transfer robot provided in the second transfer chamber directly transfers the substrate between the buffer unit, the inversion unit, and the second cleaning chamber.

公开(公告)号：US20210050235A1

公开(公告)日：2021-02-18

申请号：US16986418

申请日：2020-08-06

Applicant: SEMES CO., LTD.

Inventor： Kangseop YUN ,  Seung Hoon OH ,  Ye Jin CHOI ,  Youngil LEE ,  Byungsun BANG ,  Jungbong CHOI ,  Gui Su PARK

IPC: H01L21/67 ,  H01L21/687

Abstract: The inventive concept provides a support unit for supporting a substrate. The support unit includes a support plate that has an interior space and on which the substrate is placed, a heating member that is provided in the interior space and that heats the substrate placed on the support plate, a heat insulating plate provided in the interior space and disposed under the heating member, a reflective plate provided in the interior space and disposed under the heat insulating plate, and a heat dissipation plate provided in the interior space and disposed under the a reflective plate.

公开(公告)号：US20220379355A1

公开(公告)日：2022-12-01

申请号：US17824169

申请日：2022-05-25

Applicant: SEMES CO., LTD.

Inventor： Ye Jin CHOI ,  Cheol Hwan JEONG ,  Young Jin KIM ,  Jong Won MOON

IPC: B08B13/00 ,  B08B3/02

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a treating container having a treating space; a support unit configured to support and rotate a substrate in the treating space; an exhaust line coupled to the treating container and configured to exhaust an airflow within the treating space; a support frame provided independently of a rotation of the support unit and positioned between the treating container and the support unit; and a guide vane protruding to an outside of the support frame and configured to guide the airflow within the treating space in a downward direction.

公开(公告)号：US20210022213A1

公开(公告)日：2021-01-21

申请号：US16932286

申请日：2020-07-17

Applicant: SEMES CO., LTD.

Inventor： Muhyeon LEE ,  Gui Su PARK ,  Byungsun BANG ,  Jungbong CHOI ,  Youngil LEE ,  Kangseop YUN ,  Seung Eun NA ,  Ye Jin CHOI ,  Kyounghwan KIM

IPC: H05B3/00 ,  H05B3/06

Abstract: An apparatus for treating a substrate includes a process chamber having a treatment space defined therein, a support unit for supporting the substrate in the treatment space, a liquid supply unit for supplying treating liquid to the substrate supported on the support unit, and a heating unit disposed in the support unit for heating the substrate supported on the support unit, wherein the heating unit includes a plurality of lamps to heat the substrate, and a window disposed above the lamps to transmit light emitted from the lamps, wherein the window includes a base in a form of a plate, and light adjustment means formed on the base to spread or converge light emitted from the lamps.