WAFER TREATMENT APPARATUS AND METHOD FOR REDUCING SCATTERING OF TREATMENT LIQUID

    公开(公告)号:US20230215743A1

    公开(公告)日:2023-07-06

    申请号:US18074454

    申请日:2022-12-03

    CPC classification number: H01L21/67051 B08B3/022 B08B13/00 H01L21/68764

    Abstract: A wafer treatment apparatus includes a wafer supporter for supporting and rotating a wafer, a frontside liquid discharger for discharging a liquid toward a frontside of the wafer, a backside liquid discharger for discharging the liquid toward a backside of the wafer, a treatment chamber for accommodating the wafer supporter, and including liquid collecting inlets stacked on each other and receiving the liquid discharged from at least one of the frontside and backside liquid dischargers, and a controller for controlling a height of an upper end of a first liquid collecting inlet of the liquid collecting inlets to have one of a first height in a process of discharging the liquid to the backside of the wafer adjacent to the wafer supporter and a second height, lower than the first height, in a process of discharging the liquid to the frontside of the wafer.

    HOME POT AND AN APPARATUS FOR TREATING A SUBSTRATE

    公开(公告)号:US20230201865A1

    公开(公告)日:2023-06-29

    申请号:US18145928

    申请日:2022-12-23

    CPC classification number: B05C11/1039 B05C5/02

    Abstract: Provided is a home port in which a nozzle supplying a treating liquid to a substrate waits. The home port includes a drain cup, a housing provided to cover the drain cup and having an exhaust space exhausting a fume generated from the treating liquid, and an insertion body placed between an upper wall of the housing and the drain cup in the housing. A first exhaust passage guiding the fume to the exhaust space is formed between the insertion body and the drain cup, and a second exhaust passage guiding the fume to the exhaust space is formed between the insertion body and the housing.

    APPARATUS FOR TREATING SUBSTRATE
    6.
    发明申请

    公开(公告)号:US20220379355A1

    公开(公告)日:2022-12-01

    申请号:US17824169

    申请日:2022-05-25

    Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a treating container having a treating space; a support unit configured to support and rotate a substrate in the treating space; an exhaust line coupled to the treating container and configured to exhaust an airflow within the treating space; a support frame provided independently of a rotation of the support unit and positioned between the treating container and the support unit; and a guide vane protruding to an outside of the support frame and configured to guide the airflow within the treating space in a downward direction.

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