公开(公告)号：US20250006517A1

公开(公告)日：2025-01-02

申请号：US18672290

申请日：2024-05-23

Applicant: Semes Co., Ltd

Inventor： Sang Min LEE ,  Jong Doo LEE ,  Ju Yeon SONG

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/687

Abstract: Disclosed is a manufacturing method of a semiconductor device. The manufacturing method may include: a closing operation of seating a substrate on a support member provided in a chamber, and closing the chamber to seal a treating space provided by the chamber; a clamping operation of clamping the chamber by moving a clamping body in a direction facing the chamber after the closing operation; a close-contact operation of making the chamber be in contact with the clamping body after the clamping operation; and a substrate processing operation of drying the substrate by supplying supercritical fluid into the treating space.

公开(公告)号：US20240145263A1

公开(公告)日：2024-05-02

申请号：US18099856

申请日：2023-01-20

Applicant: SEMES CO., LTD.

Inventor： Seung Hoon OH ,  Ki Bong KIM ,  Jong Doo LEE ,  Young Hun LEE ,  Mi So PARK ,  Jin Se PARK ,  Yong Sun KO

IPC: H01L21/67

CPC classification number: H01L21/67034

Abstract: According to an aspect of the present disclosure, there is provided a substrate treating apparatus comprising: a vessel part having a substrate treatment region formed therein and including a supply port through which a treating fluid is supplied to the substrate treatment region and an exhaust port through which the treating fluid is exhausted from the substrate treatment region; a fluid supply unit configured to supply the treating fluid to the substrate treatment region; an exhaust unit configured to exhaust the treating fluid from the vessel part. The exhaust unit comprises: a main line connected to the exhaust port; an extension line branched from at least one of first and second nodes of the main line and including at least one of a first orifice or a first check valve to control an exhaust speed; and an auxiliary line branched from a third node of the main line, where an orifice and a check valve are not formed. During a first process time, the treating fluid is discharged through the extension line, and the treating fluid is not discharged through the auxiliary line, and during a second process time, the treating fluid is discharged through the auxiliary line.

公开(公告)号：US20230035940A1

公开(公告)日：2023-02-02

申请号：US17874933

申请日：2022-07-27

Applicant: SEMES CO., LTD.

Inventor： Jong Doo LEE ,  Seung Hoon OH ,  Jin Mo JAE ,  Ki Bong KIM ,  Young Hun LEE

IPC: H01L21/67

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a body; a fluid supply unit for supplying a treating fluid to a treating space within the body; and a fluid exhaust line for exhausting the treating fluid from the treating space, and wherein the body includes: a first body; a second body relatively moving with respect to the first body; and an anti-friction member for preventing a friction between the first body and the second body, and wherein the anti-friction member is configured continuously cover at least two surfaces among surfaces of the first body and the second body.

公开(公告)号：US20220381509A1

公开(公告)日：2022-12-01

申请号：US17825275

申请日：2022-05-26

Applicant: SEMES CO., LTD.

Inventor： Yong Joon IM ,  Sang Min LEE ,  Jong Doo LEE ,  Jin Se PARK

IPC: F26B5/00

Abstract: The present invention provides a substrate treating apparatus, including: a housing including a first body and a second body which are combined with each other to provide a treatment space in which a substrate is treated; an actuator which moves the second body in a vertical direction with respect to the first body to seal or open the treatment space; and a pipe which is coupled with the second body and in which a fluid flows, in which the pipe is a stretchable pipe that is stretchable and contractible according to the vertical movement of the second body.