公开(公告)号：US20230035940A1

公开(公告)日：2023-02-02

申请号：US17874933

申请日：2022-07-27

Applicant: SEMES CO., LTD.

Inventor： Jong Doo LEE ,  Seung Hoon OH ,  Jin Mo JAE ,  Ki Bong KIM ,  Young Hun LEE

IPC: H01L21/67

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a body; a fluid supply unit for supplying a treating fluid to a treating space within the body; and a fluid exhaust line for exhausting the treating fluid from the treating space, and wherein the body includes: a first body; a second body relatively moving with respect to the first body; and an anti-friction member for preventing a friction between the first body and the second body, and wherein the anti-friction member is configured continuously cover at least two surfaces among surfaces of the first body and the second body.

公开(公告)号：US20220186379A1

公开(公告)日：2022-06-16

申请号：US17503741

申请日：2021-10-18

Applicant: SEMES CO., LTD.

Inventor： Jin Mo JAE ,  Seung Hoon OH ,  Young Seop CHOI ,  Mi So PARK ,  Jong Hyeon WOO

IPC: C23C18/16

Abstract: An apparatus for treating a substrate includes a vessel having a sealable process space formed therein in which the substrate is accommodated, a supply port that is provided inside a wall of the vessel and that supplies a process fluid into the process space, an exhaust port provided inside the wall of the vessel and spaced apart from the supply port, and a buffer member provided in the process space, the buffer member being provided in a position overlapping with the supply port and the exhaust port when viewed from above. The buffer member includes a sidewall portion that is located outward of the supply port and the exhaust port and that makes contact with the wall of the vessel and an upper wall portion having a through-hole formed therein to correspond to a center of the substrate, the through-hole forming a straight flow path in an up/down direction.

公开(公告)号：US20210008606A1

公开(公告)日：2021-01-14

申请号：US16924633

申请日：2020-07-09

Applicant: SEMES CO., LTD.

Inventor： Inhwang PARK ,  Gui Su PARK ,  Young Hun LEE ,  Youngseop CHOI ,  Seung Hoon OH ,  Jonghyeon WOO ,  Jin Mo JAE

IPC: B08B7/00 ,  H01L21/67

Abstract: An apparatus for treating a substrate includes a process chamber having a treatment space for treating the substrate; a fluid supply unit for supplying fluid to the treatment space, wherein the fluid supply unit includes: a supply pipe connected to the treatment space to supply the fluid to the treatment space; a pump installed in the supply pipe to provide flow pressure to the fluid; a vent line installed between the pump and the process chamber to discharge pressure in the fluid to an outside; a relief valve installed in the vent line to open and close the vent line; and a reservoir installed between the pump and a branch point wherein the vent line branches from the supply pipe, wherein the reservoir has a cross-sectional area larger than a cross-sectional area of a portion of the supply pipe located between the pump and the branch point.

公开(公告)号：US20230129923A1

公开(公告)日：2023-04-27

申请号：US17971734

申请日：2022-10-24

Applicant: SEMES CO., LTD.

Inventor： Jin Woo JUNG ,  Jin Mo JAE ,  Sang Min LEE ,  Young Hun LEE ,  Yong Hyun CHOI ,  Yong Joon IM ,  Seung Hoon OH

IPC: H01L21/687 ,  H01L21/67 ,  B08B3/04 ,  B08B13/00

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing for providing a treating space for treating a substrate within; a support unit for supporting the substrate in the treating space; a bottom supply port for supplying a process fluid to the treating space; and a filler member positioned below the substrate supported on the support unit in the treating space, and wherein the filler member forms a buffer space facing the bottom supply port, and a passage is formed between the filler member and an inner wall of the housing and flows the process fluid which is introduced to the buffer space in a direction of the substrate.

公开(公告)号：US20220390172A1

公开(公告)日：2022-12-08

申请号：US17826936

申请日：2022-05-27

Applicant: SEMES CO., LTD.

Inventor： Jin Mo JAE ,  Seung Hoon OH

IPC: F26B5/00

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber providing an inner space; a fluid supply unit configured to supply a drying fluid to the inner space; and a fluid exhaust unit configured to exhaust the drying fluid from the inner space, and wherein the fluid exhaust unit includes an exhaust line connected to the chamber; a pressure adjusting member installed at the exhaust line and configured to maintain a pressure of the inner space at a set pressure; and a heating member installed at the pressure adjusting member or a back end of the pressure adjusting member.