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公开(公告)号:US20240145263A1
公开(公告)日:2024-05-02
申请号:US18099856
申请日:2023-01-20
Applicant: SEMES CO., LTD.
Inventor: Seung Hoon OH , Ki Bong KIM , Jong Doo LEE , Young Hun LEE , Mi So PARK , Jin Se PARK , Yong Sun KO
IPC: H01L21/67
CPC classification number: H01L21/67034
Abstract: According to an aspect of the present disclosure, there is provided a substrate treating apparatus comprising: a vessel part having a substrate treatment region formed therein and including a supply port through which a treating fluid is supplied to the substrate treatment region and an exhaust port through which the treating fluid is exhausted from the substrate treatment region; a fluid supply unit configured to supply the treating fluid to the substrate treatment region; an exhaust unit configured to exhaust the treating fluid from the vessel part. The exhaust unit comprises: a main line connected to the exhaust port; an extension line branched from at least one of first and second nodes of the main line and including at least one of a first orifice or a first check valve to control an exhaust speed; and an auxiliary line branched from a third node of the main line, where an orifice and a check valve are not formed. During a first process time, the treating fluid is discharged through the extension line, and the treating fluid is not discharged through the auxiliary line, and during a second process time, the treating fluid is discharged through the auxiliary line.
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公开(公告)号:US20220384216A1
公开(公告)日:2022-12-01
申请号:US17714999
申请日:2022-04-06
Applicant: SEMES CO., LTD.
Inventor: Jin Se PARK , Ki Bong KIM , Myung Seok CHA , Do Hyeon YOON
IPC: H01L21/67
Abstract: The present invention discloses an exhausting device and an exhausting method in substrate processing equipment, and more particularly, a technique for controlling a processing process environment by providing a buffer space for storing chemical fumes outside a ventilation unit of the substrate processing equipment, and discharging the chemical fumes into the buffer space in accordance with a processing process in a chamber interior space.
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3.
公开(公告)号:US20240203726A1
公开(公告)日:2024-06-20
申请号:US18241893
申请日:2023-09-03
Applicant: SEMES CO., LTD.
Inventor: Myung Seok CHA , Ki Bong KIM , Yong Hyun CHOI , Ju Yeon SONG
IPC: H01L21/02 , H01L21/67 , H01L21/677
CPC classification number: H01L21/02101 , H01L21/02057 , H01L21/67034 , H01L21/67748 , H01L21/6776
Abstract: Proposed are an organic solvent supplying apparatus, a substrate processing method, and a substrate processing apparatus. An organic solvent supplying apparatus according to an embodiment supplies an organic solvent to a liquid processing chamber of a substrate processing apparatus, the substrate processing apparatus including the liquid processing chamber for supplying the organic solvent to a substrate and a supercritical processing chamber for drying the substrate coated with the organic solvent using supercritical fluid. The organic solvent supplying apparatus includes a supply tank for storing the organic solvent, a supply line connected to the supply tank and the liquid processing chamber, and a cooling module provided on the supply line.
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公开(公告)号:US20230046276A1
公开(公告)日:2023-02-16
申请号:US17884709
申请日:2022-08-10
Applicant: SEMES CO., LTD.
Inventor: Sang Min LEE , Woo Jin CHUNG , Ki Bong KIM
Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber providing a treating space; and a fluid supply unit supplying a treating fluid to the chamber, and wherein the fluid supply unit includes: a supply tank storing the treating fluid; a supply line connecting the supply tank and the chamber; and a plurality of valves installed at the supply line, and wherein any one valve among the plurality of valves is provided as a safety valve, and wherein the safety valve is opened after confirming that the chamber has been switched to a closed state when supplying the treating fluid from a tank to the chamber.
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公开(公告)号:US20230035940A1
公开(公告)日:2023-02-02
申请号:US17874933
申请日:2022-07-27
Applicant: SEMES CO., LTD.
Inventor: Jong Doo LEE , Seung Hoon OH , Jin Mo JAE , Ki Bong KIM , Young Hun LEE
IPC: H01L21/67
Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a body; a fluid supply unit for supplying a treating fluid to a treating space within the body; and a fluid exhaust line for exhausting the treating fluid from the treating space, and wherein the body includes: a first body; a second body relatively moving with respect to the first body; and an anti-friction member for preventing a friction between the first body and the second body, and wherein the anti-friction member is configured continuously cover at least two surfaces among surfaces of the first body and the second body.
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