公开(公告)号：US12025921B2

公开(公告)日：2024-07-02

申请号：US17487170

申请日：2021-09-28

Applicant: SEMES CO., LTD.

Inventor： Jun Ho Kim ,  Sang Hoon Lee ,  Jong Seok Seo

IPC: G03F7/40

CPC classification number: G03F7/40

Abstract: The inventive concept provides a cooling unit. In an embodiment, the cooling unit comprises: a cooling plate with a seating surface; a pin member arranged at the cooling plate and supporting a substrate; a decompression hole formed on the seating surface; a decompression path formed within the cooling plate and connected to the decompression hole; a decompression member for decompressing the decompression path; and a controller for controlling the decompression member, wherein the controller controls the decompression member to decompress a space between the substrate and the seating surface of the cooling plate and thereby adjusting a distance between the substrate and the seating surface of the cooling plate.

公开(公告)号：US11735443B2

公开(公告)日：2023-08-22

申请号：US16538105

申请日：2019-08-12

Applicant: SEMES Co., Ltd.

Inventor： Kyung Sik Shin ,  Man Kyu Kang ,  Jun Ho Kim

IPC: H01L21/67 ,  H01L21/687 ,  B25B11/00 ,  H05B3/26

CPC classification number: H01L21/67103 ,  B25B11/005 ,  H01L21/68707 ,  H01L21/68742 ,  H05B3/26 ,  H05B2203/002 ,  H05B2203/017

Abstract: A hot plate in which holes are formed in proximity pins. The holes of the proximity pins are connected to vacuum holes to suppress generation of air flow during substrate heat treatment. A substrate heat-treating apparatus including the hot plate, and a method of fabricating the hot plate. The hot plate includes: a body with a heater; a plurality of first holes pass through the body in a downward direction; a plurality of proximity pins formed on the body support the substrate such that the substrate does not contact the top of the body. A plurality of second holes formed in at least some of the proximity pins and pass through the proximity pins in the downward direction from surfaces of the proximity pins. The first and second holes are connected to each other, and a vacuum is created inside the first and second holes to fix the substrate.

公开(公告)号：US11714356B2

公开(公告)日：2023-08-01

申请号：US17469366

申请日：2021-09-08

Applicant: Semes Co., Ltd

Inventor： Jun Ho Kim ,  Sang Hoon Lee ,  Jong Seok Seo ,  Ho Jin Jang ,  Gyeong Won Song

IPC: G03F7/40 ,  G03F7/20 ,  G03F7/00 ,  G03F7/38

CPC classification number: G03F7/40 ,  G03F7/38 ,  G03F7/70933

Abstract: The inventive concept provides a bake unit. The bake unit comprising: a housing having an upper cover and a lower frame, the upper cover and the lower cover in combination providing a treatment space for heat treatment of a substrate; a heater provided in the treatment space for heating a substrate placed thereon; a heater cup configured to surround the heater; and a first purge gas supply unit for providing a first purge gas flow to block inflow of outer air through a gap between the lower frame and the heater cup.

公开(公告)号：US20200066555A1

公开(公告)日：2020-02-27

申请号：US16538105

申请日：2019-08-12

Applicant: SEMES Co., Ltd.

Inventor： Kyung Sik Shin ,  Man Kyu Kang ,  Jun Ho Kim

IPC: H01L21/67 ,  H01L21/687 ,  H05B3/26 ,  B25B11/00

Abstract: A hot plate in which holes are formed in proximity pins. The holes of the proximity pins are connected to vacuum holes to suppress generation of air flow during substrate heat treatment. A substrate heat-treating apparatus including the hot plate, and a method of fabricating the hot plate. The hot plate includes: a body with a heater; a plurality of first holes pass through the body in a downward direction; a plurality of proximity pins formed on the body support the substrate such that the substrate does not contact the top of the body. A plurality of second holes formed in at least some of the proximity pins and pass through the proximity pins in the downward direction from surfaces of the proximity pins. The first and second holes are connected to each other, and a vacuum is created inside the first and second holes to fix the substrate.