公开(公告)号：US11776826B2

公开(公告)日：2023-10-03

申请号：US16999836

申请日：2020-08-21

Applicant: SEMES CO., LTD.

Inventor： Junho Kim ,  Kyungsik Shin ,  Youngseo An ,  Jinki Shin ,  Man Kyu Kang ,  Yoonki Sa

IPC: H01L21/67 ,  H01L21/683

CPC classification number: H01L21/67109 ,  H01L21/67017 ,  H01L21/67161 ,  H01L21/683

Abstract: An apparatus for treating a substrate includes a process chamber having a process space therein, a support unit that supports the substrate in the process space, a heating member that heats the substrate supported on the support unit, and an exhaust unit that evacuates the process space. The exhaust unit includes an exhaust duct and a heat retention unit having a retention space that retains heat released from the process space. The retention space surrounds an adjacent area located adjacent to the process chamber in the exhaust duct.

公开(公告)号：US11766765B2

公开(公告)日：2023-09-26

申请号：US16693569

申请日：2019-11-25

Applicant: SEMES CO., LTD.

Inventor： Ki Sang Eum ,  Byoung Ok Kim ,  Jae Hun Jeong ,  Ju Eun Kim ,  Jun Ho Seo ,  Man Kyu Kang

IPC: B25B11/00 ,  H01L21/68 ,  H01L21/687 ,  H01L21/683

CPC classification number: B25B11/005 ,  H01L21/68 ,  H01L21/6838 ,  H01L21/68735 ,  H01L21/68742 ,  H01L2221/68309

Abstract: A substrate treatment apparatus is provided. The substrate treatment apparatus includes a substrate support part provided with a seating surface and configured to support a substrate, a guide ring annularly disposed along an edge of the substrate support part to surround the substrate, and a centering part provided inside the guide ring and configured to center the substrate by moving in a direction parallel to the seating surface to pressurize the edge of the substrate.

公开(公告)号：US11735443B2

公开(公告)日：2023-08-22

申请号：US16538105

申请日：2019-08-12

Applicant: SEMES Co., Ltd.

Inventor： Kyung Sik Shin ,  Man Kyu Kang ,  Jun Ho Kim

IPC: H01L21/67 ,  H01L21/687 ,  B25B11/00 ,  H05B3/26

CPC classification number: H01L21/67103 ,  B25B11/005 ,  H01L21/68707 ,  H01L21/68742 ,  H05B3/26 ,  H05B2203/002 ,  H05B2203/017

Abstract: A hot plate in which holes are formed in proximity pins. The holes of the proximity pins are connected to vacuum holes to suppress generation of air flow during substrate heat treatment. A substrate heat-treating apparatus including the hot plate, and a method of fabricating the hot plate. The hot plate includes: a body with a heater; a plurality of first holes pass through the body in a downward direction; a plurality of proximity pins formed on the body support the substrate such that the substrate does not contact the top of the body. A plurality of second holes formed in at least some of the proximity pins and pass through the proximity pins in the downward direction from surfaces of the proximity pins. The first and second holes are connected to each other, and a vacuum is created inside the first and second holes to fix the substrate.

公开(公告)号：US10763152B2

公开(公告)日：2020-09-01

申请号：US15823311

申请日：2017-11-27

Applicant: SEMES CO., LTD.

Inventor： Min Woo Jo ,  Cheolmin Choi ,  Sanguk Park ,  Man Kyu Kang

IPC: B25B11/00 ,  H01L21/687 ,  H01L21/67 ,  H01L21/677

Abstract: Embodiments of the inventive concept relate to a substrate treating apparatus. A substrate support unit configured to support a substrate includes a support plate, on which the substrate is positioned, the support plate may include a passage formed on an upper surface of the support plate and connecting a central area and a side surface of the support plate, and a recess formed in a peripheral area of the support plate and recessed inwards from a side surface of the support plate, and the recess may communicate with one end of the passage.

公开(公告)号：US20200171626A1

公开(公告)日：2020-06-04

申请号：US16693569

申请日：2019-11-25

Applicant: SEMES CO., LTD.

Inventor： Ki Sang Eum ,  Byoung Ok Kim ,  Jae Hun Jeong ,  Ju Eun Kim ,  Jun Ho Seo ,  Man Kyu Kang

IPC: B25B11/00 ,  H01L21/68 ,  H01L21/687 ,  H01L21/683

Abstract: A substrate treatment apparatus is provided. The substrate treatment apparatus includes a substrate support part provided with a seating surface and configured to support a substrate, a guide ring annularly disposed along an edge of the substrate support part to surround the substrate, and a centering part provided inside the guide ring and configured to center the substrate by moving in a direction parallel to the seating surface to pressurize the edge of the substrate.

公开(公告)号：US20200066555A1

公开(公告)日：2020-02-27

申请号：US16538105

申请日：2019-08-12

Applicant: SEMES Co., Ltd.

Inventor： Kyung Sik Shin ,  Man Kyu Kang ,  Jun Ho Kim

IPC: H01L21/67 ,  H01L21/687 ,  H05B3/26 ,  B25B11/00

Abstract: A hot plate in which holes are formed in proximity pins. The holes of the proximity pins are connected to vacuum holes to suppress generation of air flow during substrate heat treatment. A substrate heat-treating apparatus including the hot plate, and a method of fabricating the hot plate. The hot plate includes: a body with a heater; a plurality of first holes pass through the body in a downward direction; a plurality of proximity pins formed on the body support the substrate such that the substrate does not contact the top of the body. A plurality of second holes formed in at least some of the proximity pins and pass through the proximity pins in the downward direction from surfaces of the proximity pins. The first and second holes are connected to each other, and a vacuum is created inside the first and second holes to fix the substrate.