公开(公告)号：US11735437B2

公开(公告)日：2023-08-22

申请号：US17132008

申请日：2020-12-23

Applicant: SEMES CO., LTD.

Inventor： Boong Kim ,  Oh Jin Kwon ,  Sungho Jang ,  Joo Jib Park

IPC: H01L21/67 ,  F26B25/14 ,  H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67028 ,  F26B25/14 ,  H01L21/6719 ,  H01L21/67034 ,  H01L21/67051 ,  H01L21/67109 ,  H01L21/67126 ,  H01L21/67178 ,  H01L21/67748 ,  H01L21/6875

Abstract: Provided are an apparatus and method for treating a substrate. Specifically, provided are an apparatus and method for treating a substrate through a supercritical process. The apparatus includes: a housing providing a space for performing a process; a support member disposed in the housing to support a substrate; a supply port configured to supply a process fluid to the housing; a shield member disposed between the supply port and the support member to prevent the process fluid from being directly injected to the substrate; and an exhaust port configured to discharge the process fluid from the housing.

公开(公告)号：US20180102263A1

公开(公告)日：2018-04-12

申请号：US15834512

申请日：2017-12-07

Applicant: SEMES CO., LTD.

Inventor： Boong Kim ,  Oh Jin Kwon ,  Sungho Jang ,  Joo Jib Park

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/677

CPC classification number: H01L21/67028 ,  F26B25/14 ,  H01L21/67034 ,  H01L21/67051 ,  H01L21/67109 ,  H01L21/67126 ,  H01L21/67178 ,  H01L21/6719 ,  H01L21/67748 ,  H01L21/6875

Abstract: Provided are an apparatus and method for treating a substrate. Specifically, provided are an apparatus and method for treating a substrate through a supercritical process. The apparatus includes: a housing providing a space for performing a process; a support member disposed in the housing to support a substrate; a supply port configured to supply a process fluid to the housing; a shield member disposed between the supply port and the support member to prevent the process fluid from being directly injected to the substrate; and an exhaust port configured to discharge the process fluid from the housing.