公开(公告)号：US20230207350A1

公开(公告)日：2023-06-29

申请号：US18147400

申请日：2022-12-28

Applicant: SEMES CO., LTD.

Inventor： Tae Shin KIM ,  Young Dae Chung ,  Won-Geun Kim ,  Jee Young Lee ,  Ji Hoon Jeong

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67115 ,  H01L21/67248 ,  H01L21/6715 ,  H01L21/68764

Abstract: Provided is an apparatus for treating a substrate, which includes: a chamber having a treating space; a substrate support unit supporting and rotating a substrate in the treating space; a liquid supply unit supplying a chemical liquid to the substrate supported on the substrate support unit; a laser irradiation unit irradiating a laser to a bottom of the substrate supported on the substrate support unit; and a laser reflection unit coupled to the laser irradiation unit, and reflecting the laser irradiated and reflected to the bottom of the substrate, in which the laser reflection unit includes a reflection member reflecting the laser reflected from the substrate, and a driving member tilting the reflection member at a predetermined tilt angle.

公开(公告)号：US12224200B2

公开(公告)日：2025-02-11

申请号：US17394868

申请日：2021-08-05

Applicant: SEMES CO., LTD.

Inventor： Ji Hoon Jeong ,  Won-Geun Kim ,  Young Dae Chung ,  Jee Young Lee ,  Tae Shin Kim

IPC: H01L21/687 ,  H01L21/67

Abstract: The present disclosure provides a substrate treating apparatus. The substrate treating apparatus includes a support unit that supports a substrate, and a heating unit that irradiates a beam to the substrate and heat the substrate, and the heating unit further includes an irradiation part that irradiates the beam, and a rotation part that rotates the beam.