公开(公告)号：US20230207350A1

公开(公告)日：2023-06-29

申请号：US18147400

申请日：2022-12-28

Applicant: SEMES CO., LTD.

Inventor： Tae Shin KIM ,  Young Dae Chung ,  Won-Geun Kim ,  Jee Young Lee ,  Ji Hoon Jeong

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67115 ,  H01L21/67248 ,  H01L21/6715 ,  H01L21/68764

Abstract: Provided is an apparatus for treating a substrate, which includes: a chamber having a treating space; a substrate support unit supporting and rotating a substrate in the treating space; a liquid supply unit supplying a chemical liquid to the substrate supported on the substrate support unit; a laser irradiation unit irradiating a laser to a bottom of the substrate supported on the substrate support unit; and a laser reflection unit coupled to the laser irradiation unit, and reflecting the laser irradiated and reflected to the bottom of the substrate, in which the laser reflection unit includes a reflection member reflecting the laser reflected from the substrate, and a driving member tilting the reflection member at a predetermined tilt angle.

公开(公告)号：US11715651B2

公开(公告)日：2023-08-01

申请号：US17079445

申请日：2020-10-24

Applicant: SEMES CO., LTD.

Inventor： Young Dae Chung ,  Won Geun Kim ,  Jee Young Lee ,  Ji Hoon Jeong ,  Tae Shin Kim ,  Jung Suk Goh ,  Cheng Bin Cui ,  Ye Rim Yeon

IPC: H01L21/67

CPC classification number: H01L21/6708 ,  H01L21/67115 ,  H01L21/67248 ,  H01L21/67253

Abstract: A substrate treatment apparatus includes a substrate support unit, a chemical supply unit supplying a chemical solution onto an upper surface of a substrate supported on the substrate support unit, a laser irradiation unit applying a laser pulse to the substrate to heat the substrate, and a controller controlling the laser irradiation unit to emit the laser pulse such that the substrate is repeatedly heated and cooled to maintain a preset temperature.

公开(公告)号：US11923213B2

公开(公告)日：2024-03-05

申请号：US17128159

申请日：2020-12-20

Applicant: SEMES CO., LTD.

Inventor： Tae Shin Kim ,  Young Dae Chung ,  Ji Hoon Jeong ,  Jee Young Lee ,  Won Geun Kim

IPC: H01L23/00 ,  B08B3/10 ,  B23K26/00 ,  B23K26/06 ,  B23K26/064 ,  B23K26/352 ,  G02B7/02 ,  G02B27/09 ,  H01L21/02 ,  H01L21/268 ,  H01L21/66 ,  H01L21/67 ,  H01L21/687 ,  B23K101/40 ,  B23K103/00

CPC classification number: H01L21/67115 ,  B08B3/10 ,  B23K26/0006 ,  B23K26/0604 ,  B23K26/0626 ,  B23K26/064 ,  B23K26/352 ,  G02B7/028 ,  G02B27/0916 ,  G02B27/0955 ,  H01L21/02057 ,  H01L21/268 ,  H01L21/67051 ,  H01L21/67248 ,  H01L21/68764 ,  H01L22/20 ,  B23K2101/40 ,  B23K2103/56

Abstract: Proposed is a substrate heating unit including: a laser generator providing a laser beam for heating a substrate; and a beam shaper processing the laser beam from the laser generator and selectively providing one of a first beam having a uniform energy distribution and a second beam having an edge-enhanced energy distribution to the substrate.

公开(公告)号：US12224200B2

公开(公告)日：2025-02-11

申请号：US17394868

申请日：2021-08-05

Applicant: SEMES CO., LTD.

Inventor： Ji Hoon Jeong ,  Won-Geun Kim ,  Young Dae Chung ,  Jee Young Lee ,  Tae Shin Kim

IPC: H01L21/687 ,  H01L21/67

Abstract: The present disclosure provides a substrate treating apparatus. The substrate treating apparatus includes a support unit that supports a substrate, and a heating unit that irradiates a beam to the substrate and heat the substrate, and the heating unit further includes an irradiation part that irradiates the beam, and a rotation part that rotates the beam.

公开(公告)号：US12094733B2

公开(公告)日：2024-09-17

申请号：US17073342

申请日：2020-10-17

Applicant: SEMES CO., LTD.

Inventor： Young Dae Chung ,  Won Geun Kim ,  Jee Young Lee ,  Ji Hoon Jeong ,  Tae Shin Kim ,  Se Hoon Oh ,  Pil Kyun Heo ,  Hyun Goo Park

IPC: H01L21/67 ,  H01L21/306 ,  C09K13/04

CPC classification number: H01L21/6708 ,  H01L21/30604 ,  H01L21/67115 ,  C09K13/04

Abstract: Disclosed is a substrate treatment apparatus including a rotation unit that supports and rotates a substrate, a chemical discharge unit that discharges a chemical solution to the rotation unit, a chemical recovery unit disposed close to the rotation unit and configured to recover the chemical solution scattering from the rotation unit, and a laser irradiation unit that applies a laser beam to the substrate and heats the substrate.

公开(公告)号：US11495467B2

公开(公告)日：2022-11-08

申请号：US17115313

申请日：2020-12-08

Applicant: SEMES CO., LTD.

Inventor： Jung Suk Goh ,  Jae Seong Lee ,  Do Youn Lim ,  Kuk Saeng Kim ,  Young Dae Chung ,  Tae Shin Kim ,  Jee Young Lee ,  Won Geun Kim ,  Ji Hoon Jeong ,  Kwang Sup Kim ,  Pil Kyun Heo ,  Yoon Ki Sa ,  Ye Rim Yeon ,  Hyun Yoon ,  Do Yeon Kim ,  Yong Jun Seo ,  Byeong Geun Kim ,  Young Je Um

IPC: H01L21/26 ,  H01L21/311 ,  H01L21/67 ,  H01L21/66

Abstract: Method and apparatus for etching a thin layer including silicon nitride formed on a substrate are disclosed. Etchant including phosphoric acid and water is supplied on the substrate so that a liquid layer is formed on the substrate. The thin layer is etched by reaction between the thin layer and the etchant. Thickness of the liquid layer is measured to detect variation in the thickness of the liquid layer while etching the thin layer. Variation in the concentration of the phosphoric acid and the water is calculated based on the variation in the thickness of the liquid layer. Water is supplied on the substrate based on the variation in the concentration of the phosphoric acid and the water so that the concentration of the phosphoric acid and the water becomes a predetermined value.