摘要:
A vapor chamber includes a sealed flattened casing containing working liquid therein, a wick structure arranged on an inner face of the casing, a supporting plate received in the casing and a plurality of supporting posts. The supporting plate defines a plurality of fixing holes therein. The supporting posts are engagingly received in the fixing holes of the supporting plate. Top and bottom ends of the supporting posts engage with the wick structure to reinforce a structure of the vapor chamber.
摘要:
A vapor chamber includes a sealed flattened casing containing working liquid therein, a wick structure arranged on an inner face of the casing, a plurality of supporting posts received in the casing and at least a metallic wire connecting the supporting posts. Each supporting post defines at least a channel therein. The at least a metallic wire engagingly extends through the channels of the supporting posts. Top and bottom ends of the supporting posts engage the wick structure to reinforce a structure of the vapor chamber.
摘要:
An exemplary flat heat pipe includes a flat housing, a wick, a working fluid, and a supporting element. The wick is attached to an inner surface of the housing. The working fluid is contained in the housing. The supporting element is a woven screen made of metal wires and a plurality of through holes is defined therein. The supporting element is enclosed by the wick and opposite sides thereof bias the wick against opposite portions of the housing.
摘要:
A vapor chamber includes a container, a wick structure attached to an inner surface of the container, and a supporting structure received in the container and abutting against opposite sidewalls of the container. The supporting structure is generally in the form of a metallic sheet and comprises a plurality of supporting members extending upwardly from thereof. A through hole is defined in the supporting member from top to bottom. An opening is defined between the adjoining supporting members. Opposite ends of the supporting members abut against the wick structure located at the opposite sidewalls of the container.
摘要:
A light source device includes a first heat dissipation structure, an LED module, a heat energy convertor and a fan. The first heat dissipation structure includes a heat dissipation base, a first fin group attached on a top surface of the heat dissipation base. The LED module is attached on a bottom surface of the heat dissipation base of the first heat dissipation structure. The heat energy convertor is thermally connected to the heat dissipation base of the first heat dissipation structure through heat pipes, and configured for changing heat energy generated by the LED module into kinetic energy. The fan is disposed over the first fin group and driven by the heat energy convertor.
摘要:
An LED lamp comprises a lamp housing, a heat sink made of metal and mounted at a bottom side of the lamp housing, a plurality of LED modules, and a vapor chamber having a bottom surface thereof attached to a top surface of the heat sink and having a top surface thereof to which the LED modules are attached, a working liquid is sealed in the vapor chamber. The vapor chamber defines a sealed chamber therein, and the working liquid is phase changeable liquid and is sealed in the sealed chamber. A plurality of ribs is arranged in the vapor chamber for strengthening an integrity of the vapor chamber, and the ribs divide the sealed chamber into a plurality of communicating spaces.
摘要:
An LED lamp includes a heat sink, a centrifugal blower and a plurality of LED modules. The heat sink includes a base plate defining an air intake adjacent to an end of the base plate and a plurality of fins extending downwardly from a bottom surface of the base plate, between the air intake and an opposite remote end of the base plate. The centrifugal blower is mounted on the bottom surface of the base plate and located between the air intake and the fins. The LED modules are fixed on a top surface of the base plate of the heat sink. The housing engages with the base plate to enclose the centrifugal blower and the fins therein and cooperates with the base plate to define an exhaust port between the opposite remote end of the base plate and a corresponding sidewall of the housing.
摘要:
A heat dissipation device adapted for removing heat from a heat-generating electronic device, includes a base, a first fin unit arranged on a top surface of the base. The base includes a base plate, a spreader and a heat pipe group sandwiched between the base plate and the spreader. The base plate defines therein an opening. The heat pipe group has an inserting protrusion and a receiving recession opposing the inserting protrusion. The inserting protrusion protrudes upwardly from a top surface of the heat pipe group and is embedded in the opening of the base plate. The receiving recession recesses upwardly from a bottom surface of the heat pipe group and receives therein the spreader.
摘要:
A liquid cooling device includes a casing having an outer wall, a bottom base attached to a bottom end of the outer wall and a top cover attached to a top end of the outer wall. The casing defines a receiving space therein for receiving an impeller therein. A sealed chamber is defined in the casing and isolated from the receiving space. A motor driving unit is received in the sealed chamber and magnetically interacts with the impeller to drive the impeller to rotate. The motor driving unit comprises a motor having a stator and a printed circuit board electrically connecting with the stator. The top cover covers the motor driving unit and thermally contacts with electronic components on the printed circuit board for dissipating heat generated by the electronic components when the motor driving unit is operated.
摘要:
A memory module assembly includes a printed circuit board (30) having a heat-generating electronic component (32) thereon, a heat sink (10) and a clip (20) for securing the heat sink onto the heat-generating electronic component. The heat sink includes a base (12) and a plurality of fins (14) arranged on the base. A plurality of recesses is defined in the heat sink. The clip includes a body (22) resting against a face of the printed circuit board and elastic hooks (24) extending from the body. The hooks are received in the recesses and resiliently press the base of the heat sink toward the heat-generating electronic component, whereby the clip clamps the heat sink and the printed circuit board together.