公开(公告)号：US20090151898A1

公开(公告)日：2009-06-18

申请号：US11959328

申请日：2007-12-18

申请人： CHI-YUAN LAI ,  ZHI-YONG ZHOU ,  CHENG-TIEN LAI

发明人： CHI-YUAN LAI ,  ZHI-YONG ZHOU ,  CHENG-TIEN LAI

IPC分类号： F28F7/02

CPC分类号： F28D15/0233 ,  H01L23/4006 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate includes a panel contacting the heat pipes, two sidewalls extending upwardly from the panel and separated from the heat pipes, and two flanges extending oppositely from the two sidewalls and soldered on the upper plate. The heat pipes are juxtaposed with each other at a central position thereof, and partially spaced from each other at two opposite end positions thereof.

摘要翻译： 用于冷却电子部件的散热适配器包括分别固定在上板和下板上的下板，上板，上翅片组和下翅片组，以及夹在上板和下板之间的多个热管 下板。 下板包括接触热管的面板，从面板向上延伸并与热管分离的两个侧壁，以及两个从两个侧壁相反延伸并焊接在上板上的凸缘。 热管在其中心位置处彼此并置，并且在其两个相对的端部位置彼此部分间隔开。

公开(公告)号：US20090225518A1

公开(公告)日：2009-09-10

申请号：US12202393

申请日：2008-09-01

申请人： CHI-YUAN LAI ,  ZHI-YONG ZHOU ,  CHENG-TIEN LAI

发明人： CHI-YUAN LAI ,  ZHI-YONG ZHOU ,  CHENG-TIEN LAI

IPC分类号： H05K7/20 ,  B23P6/00

CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/0275 ,  F28F3/02 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

摘要： A heat sink for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate forms a protrusion projecting downwardly therefrom. A bottom surface of the protrusion is milled to be flat and smooth, whereby the bottom surface can intimately contact the electronic component. A method for manufacturing the heat sink comprising milling a bottom surface of a protrusion punched downwardly from a lower plate, whereby the bottom surface can be flat and smooth sufficiently to have an intimate contact with an electronic component, and sequentially welding an upper plate on the lower plate and a plurality of fins on the lower plate and the upper plate, respectively.

摘要翻译： 用于冷却电子部件的散热器包括分别固定在上板和下板上的下板，上板，上翅片组和下翅片组，以及夹在上板和下板之间的多个热管 下板 下板形成从其向下突出的突起。 突起的底面被研磨成平坦和平滑的，由此底部表面可以紧密接触电子部件。 一种用于制造散热器的方法，包括：铣削从下板向下冲压的突起的底面，由此底表面可以平坦和平滑，足以与电子元件紧密接触，并且将上板依次焊接在 下板和分别在下板和上板上的多个翅片。

公开(公告)号：US20100103674A1

公开(公告)日：2010-04-29

申请号：US12422300

申请日：2009-04-13

申请人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  CHI-YUAN LAI

发明人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  CHI-YUAN LAI

IPC分类号： F21S4/00 ,  F21V29/00

CPC分类号： F21V29/70 ,  F21V29/004 ,  F21V29/51 ,  F21V29/75 ,  F21V29/763 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2924/0002 ,  H01L2924/00

摘要： An LED lamp comprises a lamp housing, a heat sink made of metal and mounted at a bottom side of the lamp housing, a plurality of LED modules, and a vapor chamber having a bottom surface thereof attached to a top surface of the heat sink and having a top surface thereof to which the LED modules are attached, a working liquid is sealed in the vapor chamber. The vapor chamber defines a sealed chamber therein, and the working liquid is phase changeable liquid and is sealed in the sealed chamber. A plurality of ribs is arranged in the vapor chamber for strengthening an integrity of the vapor chamber, and the ribs divide the sealed chamber into a plurality of communicating spaces.

摘要翻译： LED灯包括灯壳体，由金属制成的散热器并安装在灯壳的底侧，多个LED模块和蒸汽室，其底表面连接到散热器的顶表面， 具有其上附接有LED模块的顶表面，工作液体被密封在蒸气室中。 蒸气室在其中限定了一个密封室，工作液体是相变液体，并被密封在密封室中。 多个肋布置在蒸气室中，用于加强蒸气室的完整性，并且肋将密封室分成多个连通空间。

公开(公告)号：US20110255285A1

公开(公告)日：2011-10-20

申请号：US12824208

申请日：2010-06-27

申请人： CHENG-TIEN LAI ,  CHI-YUAN LAI ,  ZHI-YONG ZHOU

发明人： CHENG-TIEN LAI ,  CHI-YUAN LAI ,  ZHI-YONG ZHOU

IPC分类号： F21V29/00

CPC分类号： F21V29/83 ,  F21V29/507 ,  F21V29/745 ,  F21V29/80 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K2201/09063 ,  H05K2201/10106

摘要： An exemplary illumination device includes an enclosure, a semiconductor light source accommodated in the enclosure, and an envelope engaged with the enclosure and covering the semiconductor light source. Light generated by the semiconductor light source can project through the envelope and out of the illumination device. The semiconductor light source includes a plurality of light source modules independent from each other. A plurality of air passages are defined in each light source module for air passing therethrough to dissipate heat generated by the semiconductor light source into ambient air.

摘要翻译： 示例性照明装置包括外壳，容纳在外壳中的半导体光源以及与外壳接合并覆盖半导体光源的外壳。 由半导体光源产生的光可以穿过信封突出并且离开照明装置。 半导体光源包括彼此独立的多个光源模块。 在每个光源模块中限定多个空气通道，用于穿过其中的空气将半导体光源产生的热量散发到环境空气中。

公开(公告)号：US20090151921A1

公开(公告)日：2009-06-18

申请号：US11959438

申请日：2007-12-18

申请人： CHI-YUAN LAI ,  ZHI-YONG ZHOU ,  CHENG-TIEN LAI

发明人： CHI-YUAN LAI ,  ZHI-YONG ZHOU ,  CHENG-TIEN LAI

IPC分类号： F28F3/00

CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate fixed on the lower plate, and a plurality of heat pipes sandwiched between the lower plate and the upper plate. The lower plate includes a panel, a pair of sidewalls extending upwardly from two opposite sides of the panel, and a plurality of flanges extending upwardly from the sidewalls, respectively. The upper plate defines a plurality of cutouts corresponding to the flanges. The flanges fit into the cutouts to position the upper plate on the lower plate, whereby the lower plate and the upper plate are mechanically connected together.

摘要翻译： 用于冷却电子部件的散热适配器包括下板，固定在下板上的上板和夹在下板与上板之间的多个热管。 下板包括面板，从面板的两个相对侧向上延伸的一对侧壁和分别从侧壁向上延伸的多个凸缘。 上板限定对应于凸缘的多个切口。 凸缘装配到切口中以将上板定位在下板上，由此下板和上板机械连接在一起。

公开(公告)号：US20090166000A1

公开(公告)日：2009-07-02

申请号：US11964919

申请日：2007-12-27

申请人： CHI-YUAN LAI ,  ZHI-YONG ZHOU ,  CHENG-TIEN LAI

发明人： CHI-YUAN LAI ,  ZHI-YONG ZHOU ,  CHENG-TIEN LAI

IPC分类号： F28F1/12

CPC分类号： F28F1/126 ,  F28D15/0233 ,  F28D15/0275 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate includes a panel contacting the heat pipes, two sidewalls extending upwardly from the panel and separated from the heat pipes, and two flanges extending oppositely from the two sidewalls and soldered on the upper plate. The heat pipes are S-shaped and juxtaposed and directly contact with each other from beginning to end.

摘要翻译： 用于冷却电子部件的散热适配器包括分别固定在上板和下板上的下板，上板，上翅片组和下翅片组，以及夹在上板和下板之间的多个热管 下板。 下板包括接触热管的面板，从面板向上延伸并与热管分离的两个侧壁，以及两个从两个侧壁相反延伸并焊接在上板上的凸缘。 热管是S形并列并且从头到尾直接接触。

公开(公告)号：US20090159252A1

公开(公告)日：2009-06-25

申请号：US11961363

申请日：2007-12-20

申请人： CHI-YUAN LAI ,  ZHI-YONG ZHOU ,  CHENG-TIEN LAI

发明人： CHI-YUAN LAI ,  ZHI-YONG ZHOU ,  CHENG-TIEN LAI

IPC分类号： F28F1/10 ,  F28F7/00

CPC分类号： F28D15/0275 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate forms a plurality of bumps projecting upwardly therefrom, which sandwich the heat pipes therebetween to position the heat pipes on the lower plate, wherein some of the heat pipes are bent and sandwiched between two bumps at each bended position, and some of the heat pipes are straight and located near one bump at each end portion thereof.

摘要翻译： 用于冷却电子部件的散热适配器包括分别固定在上板和下板上的下板，上板，上翅片组和下翅片组，以及夹在上板和下板之间的多个热管 下板。 下板形成从其向上突出的多个凸起，其将热管夹在其间以将热管定位在下板上，其中一些热管弯曲并夹在每个弯曲位置的两个凸块之间， 热管是直的并且位于其每个端部处的一个凸起附近。

公开(公告)号：US20090166005A1

公开(公告)日：2009-07-02

申请号：US11967069

申请日：2007-12-29

申请人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

发明人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

IPC分类号： F28D15/04 ,  H01L23/427

CPC分类号： F28D15/046 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A vapor chamber includes a base (100) and a cover (200). The cover is mounted on the base with a hermetically sealed cavity (102) defined between the base and the cover. A working fluid is contained in the cavity. A first wick structure (220) is spread on an inner surface (201) of the cover. A second wick structure (221) is disposed in the cavity. A third wick structure (110) is spread on an inner surface (101) of the base, and the second wick structure extends between the first wick structure and the third wick structure. A first vapor space (300) is defined in the cavity and surrounds the second wick structure. A second vapor space (400) is defined in the second wick structure and communicated with the first vapor space.

摘要翻译： 蒸气室包括基座（100）和盖子（200）。 盖子安装在基座上，并具有限定在基座和盖子之间的气密密封腔（102）。 工作流体包含在空腔中。 第一芯结构（220）分散在盖的内表面（201）上。 第二芯结构（221）设置在空腔中。 第三芯结构（110）分散在基座的内表面（101）上，第二芯结构在第一芯结构和第三芯结构之间延伸。 第一蒸气空间（300）被限定在空腔中并且围绕第二芯结构。 第二蒸汽空间（400）被限定在第二吸芯结构中并且与第一蒸气空间连通。

公开(公告)号：US20070263359A1

公开(公告)日：2007-11-15

申请号：US11308839

申请日：2006-05-12

申请人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

发明人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

摘要： A memory module assembly includes a printed circuit board (10) having a main heat-generating electronic component (52) thereon, first and second heat sinks (20), (30) attached on opposite sides of the printed circuit board and a clamp (40) clamping the first, second heat sinks and the printed circuit board together. The first heat sink comprises a pair of positioning poles (24). The second heat sink comprises a heat pipe (36) disposed therein and thermally connecting therewith. The clamp comprises a connecting portion (42) and a pair of elastic pressing portions (44). The clamp resiliently presses the second heat sink toward the main heat-generating electronic component and the first heat sink engages with the second heat sink via the positioning poles of the first heat sink extending in and engaging with the second heat sink.

摘要翻译： 存储模块组件包括其上具有主要发热电子部件（52）的印刷电路板（10），安装在印刷电路板的相对侧上的第一和第二散热器（20），（30）和夹具 40）将第一，第二散热器和印刷电路板夹在一起。 第一散热器包括一对定位极（24）。 第二散热器包括设置在其中并与其热连接的热管（36）。 夹具包括连接部分（42）和一对弹性按压部分（44）。 夹具将第二散热器弹性地压向主发热电子部件，并且第一散热器经由第一散热器的定位极与第二散热器接合，第一散热器的定位极延伸并与第二散热器接合。

公开(公告)号：US20070246204A1

公开(公告)日：2007-10-25

申请号：US11309491

申请日：2006-08-11

申请人： CHENG-TIEN LAI ,  Zhi-Yong Zhou

发明人： CHENG-TIEN LAI ,  Zhi-Yong Zhou

IPC分类号： F28F3/00

CPC分类号： F28F3/086 ,  F28F3/12 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid cooling device includes a base, a housing and a heat exchanger. The base and the housing enclose a chamber which receives the heat exchanger therein. Inlet and outlet for liquid are provided at the housing. The heat exchanger includes stacked flakes. Each flake includes parallel and alternately arranged first and second strips each having a void defined therein. The flakes are stacked in a manner such that each first strip overlays and abuts against a corresponding second strip of an adjacent flake and that the void in each first strip and the void in the corresponding second strip of the adjacent flake are in fluid communication with each other to thereby form a channel between the inlet and the outlet.

摘要翻译： 液体冷却装置包括基座，壳体和热交换器。 基座和壳体包围容纳热交换器的腔室。 在壳体处设有用于液体的入口和出口。 热交换器包括堆积的薄片。 每个薄片包括平行且交替布置的第一和第二条带，每个带有限定在其中的空隙。 薄片以这样的方式堆叠，使得每个第一条覆盖并邻接相邻片状物的对应的第二条带，并且每个第一条带中的空隙和相邻片状物的相应第二条带中的空隙与每个 从而在入口和出口之间形成通道。