公开(公告)号：US11744013B2

公开(公告)日：2023-08-29

申请号：US15841439

申请日：2017-12-14

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Minshe Su ,  Duye Li ,  Shanyin Yan ,  Qianfa Liu ,  Zhongqiang Yang

IPC: H05K1/03 ,  B32B17/02 ,  B32B25/16 ,  B32B5/26 ,  C08J5/24 ,  H05K1/02

CPC classification number: H05K1/0373 ,  B32B5/26 ,  B32B17/02 ,  B32B25/16 ,  C08J5/244 ,  C08J5/249 ,  H05K1/0237 ,  H05K1/0366 ,  B32B2262/101 ,  B32B2307/204 ,  C08J2300/24 ,  C08J2325/10 ,  C08J2400/26 ,  C08J2423/16 ,  H05K2201/0154 ,  H05K2201/0278 ,  H05K2201/068

Abstract: The present invention relates to a composite, a high-frequency circuit substrate prepared therefrom and a process for preparing the same. Such composite includes (1) from 20 to 70 parts by weight of a thermosetting mixture, including (A) a thermosetting resin based on polybutadiene or a copolymer resin of polybutadiene and styrene having a molecular weight of 11,000 or less, being composed of carbon and hydrogen elements and containing 60% or more of vinyl groups, and (B) an ethylene-propylene rubber having a weight-average molecular weight of greater than 100,000 and less than 150,000 and a number-average molecular weight of greater than 60,000 and less than 100,000 and being in a solid state at room temperature; (2) from 10 to 60 parts by weight of a glass fiber cloth; (3) from 0 to 70 parts by weight of a powder filler; and (4) from 1 to 3 parts by weight of a curing initiator. The composite of the present invention has good solvent solubility and good process operability. The high-frequency circuit substrate made by using the composite has good high frequency dielectric properties and better thermal oxidative aging performance.