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1.发明申请公开(公告)号：US20180263115A1
公开(公告)日：2018-09-13
申请号：US15841439
申请日：2017-12-14
发明人： Minshe SU , Duye LI , Shanyin YAN , Qianfa LIU , Zhongqiang YANG
CPC分类号： H05K1/0373 , B32B5/26 , B32B17/02 , B32B25/16 , B32B2262/101 , B32B2307/204 , C08J5/24 , C08J2300/24 , C08J2325/10 , C08J2400/26 , C08J2423/16 , H05K1/0237 , H05K1/0366 , H05K2201/0154 , H05K2201/0278 , H05K2201/068
摘要： The present invention relates to a composite, a high-frequency circuit substrate prepared therefrom and a process for preparing the same. Such composite comprises (1) from 20 to 70 parts by weight of a thermosetting mixture, comprising (A) a thermosetting resin based on polybutadiene or a copolymer resin of polybutadiene and styrene having a molecular weight of 11,000 or less, being composed of carbon and hydrogen elements and containing 60% or more of vinyl groups, and (B) an ethylene-propylene rubber having a weight-average molecular weight of greater than 100,000 and less than 150,000 and a number-average molecular weight of greater than 60,000 and less than 100,000 and being in a solid state at room temperature; (2) from 10 to 60 parts by weight of a glass fiber cloth; (3) from 0 to 70 parts by weight of a powder filler; and (4) from 1 to 3 parts by weight of a curing initiator. The composite of the present invention has good solvent solubility and good process operability. The high-frequency circuit substrate made by using the composite has good high frequency dielectric properties and better thermal oxidative aging performance.
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公开(公告)号：US20140357147A1
公开(公告)日：2014-12-04
申请号：US14068389
申请日：2013-10-31
发明人： Tae Hong MIN , Sang Hoon KIM , Hye Jin KIM
CPC分类号： H05K1/0271 , H05K1/0306 , H05K1/038 , H05K3/022 , H05K3/4605 , H05K2201/0212 , H05K2201/0278 , H05K2201/029 , H05K2201/068 , H05K2201/09136 , H05K2203/1545 , Y10T428/249921 , Y10T442/2861 , Y10T442/2902
摘要： Disclosed herein is a core made of a glass material so as to be capable of preventing generation of warpage in a printed circuit board due to a difference in a coefficient of thermal expansion at the time of manufacturing the printed circuit board. The core includes: an organic cloth; and a glass having the organic cloth formed therein. The core is manufactured in a form in which rigidity thereof is increased by impregnating the organic cloth having a negative coefficient of thermal expansion is impregnated in a liquid-phase glass, thereby making it possible to effectively prevent generation of warpage in the printed circuit board due to the difference in a coefficient of thermal expansion.
摘要翻译： 这里公开了一种由玻璃材料制成的芯体，以便能够防止由于印刷电路板制造时的热膨胀系数的差异而在印刷电路板中产生翘曲。 核心包括：有机布; 以及其中形成有机布的玻璃。 通过将具有负的热膨胀系数的有机布浸渍浸渍在液相玻璃中，使其硬度提高的形式制造芯，由此能够有效地防止由于印刷电路板产生翘曲 到热膨胀系数的差异。
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公开(公告)号：US20140290979A1
公开(公告)日：2014-10-02
申请号：US13854292
申请日：2013-04-01
发明人： Jake Joo , Jerome Claracq , Sylvie Vervoort , Mubasher Bashir , Peter Trefonas , Garo Khanarian , Kathleen O'Connell
CPC分类号： H05K1/0274 , G06F2203/04103 , G06F2203/04112 , H05K3/0079 , H05K3/061 , H05K3/067 , H05K9/0084 , H05K2201/0108 , H05K2201/0278
摘要： Method of manufacturing patterned conductor is provided, comprising: providing a conductivised substrate, wherein the conductivised substrate comprises a substrate and an electrically conductive layer; providing an electrically conductive layer etchant; providing a spinning material; providing a masking fiber solvent; forming a plurality of masking fibers and depositing the plurality of masking fibers onto the electrically conductive layer; exposing the electrically conductive layer to the electrically conductive layer etchant, wherein the electrically conductive layer that is uncovered by the plurality of masking fibers is removed from the substrate, leaving an interconnected conductive network on the substrate covered by the plurality of masking fibers; and, exposing the plurality of masking fibers to the masking fiber solvent, wherein the plurality of masking fibers are removed to uncover the interconnected conductive network on the substrate.
摘要翻译： 提供制造图案化导体的方法，包括：提供导电基底，其中所述电导基底包括基底和导电层; 提供导电层蚀刻剂; 提供纺纱材料; 提供掩蔽纤维溶剂; 形成多个掩模光纤，并将多个掩模光纤沉积到导电层上; 将所述导电层暴露于所述导电层蚀刻剂，其中由所述多个掩蔽光纤未覆盖的所述导电层从所述衬底移除，在由所述多个掩蔽光纤覆盖的所述衬底上留下互连的导电网络; 以及将所述多个屏蔽纤维暴露于掩蔽纤维溶剂中，其中去除所述多个掩蔽纤维以露出所述基底上的所述互连的导电网络。
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4.发明授权Printed wiring board with reinforced insulation layer and manufacturing method thereof 有权具有加强绝缘层的印刷电路板及其制造方法公开(公告)号：US08710374B2
公开(公告)日：2014-04-29
申请号：US12360181
申请日：2009-01-27
IPC分类号： H05K1/02
CPC分类号： H05K3/4661 , H05K1/0366 , H05K3/381 , H05K3/4602 , H05K3/4688 , H05K2201/0209 , H05K2201/0278 , H05K2201/0293 , H05K2201/096
摘要： A printed wiring board is manufactured by a method in which a core substrate having an insulation substrate and a conductive circuit formed on the insulation substrate is provided. An inner insulation layer is formed on the core substrate, and a surface of the inner insulation layer is treated to form a roughened portion on the surface. An outer insulation layer including a reinforcing material is formed on the surface of the inner insulation layer having the roughened portion.
摘要翻译： 通过设置具有绝缘基板和形成在绝缘基板上的导电电路的芯基板的方法制造印刷布线板。 在芯基板上形成内绝缘层，处理内绝缘层的表面以在表面上形成粗糙部分。 在具有粗糙部分的内绝缘层的表面上形成包括增强材料的外绝缘层。
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公开(公告)号：US20120231689A1
公开(公告)日：2012-09-13
申请号：US13075147
申请日：2011-03-29
申请人： Deok Hoon Kim , Kyung Wook Paik , Kyoung Lim Suk , Jae Ok Kim
发明人： Deok Hoon Kim , Kyung Wook Paik , Kyoung Lim Suk , Jae Ok Kim
CPC分类号： H01R4/04 , C08G2650/40 , C08L71/00 , C08L71/02 , C08L77/00 , C08L77/10 , C08L79/04 , C08L81/02 , C08L81/06 , C09J133/08 , C09J133/20 , C09J133/24 , C09J135/06 , C09J143/04 , D01D5/0007 , D01F1/10 , H01R12/52 , H05K3/323 , H05K2201/0278 , H05K2201/029 , Y10T428/254 , Y10T428/28 , Y10T428/2852 , Y10T428/287 , Y10T428/2874 , Y10T428/2878 , Y10T428/2887 , Y10T428/2891 , Y10T428/2896 , Y10T442/30
摘要： Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.
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6.发明授权Aramid filled polyimides having advantageous thermal expansion properties, and methods relating thereto 失效具有有利的热膨胀性能的芳族聚酰胺填充的聚酰亚胺及其相关的方法公开(公告)号：US08124223B2
公开(公告)日：2012-02-28
申请号：US12848408
申请日：2010-08-02
CPC分类号： C09J179/08 , C08L77/10 , C08L2205/16 , C08L2666/20 , H05K1/0373 , H05K3/281 , H05K3/386 , H05K2201/0154 , H05K2201/0251 , H05K2201/0278 , H05K2201/068 , Y10T428/1023 , Y10T428/24917 , Y10T428/28 , Y10T428/2804 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721 , Y10T442/2361
摘要： The invention is directed to polyimide based adhesives having a coefficient of thermal expansion (“CTE”) equal to or below 50 ppm/° C. The adhesives of the present invention contain a polyimide base polymer present in the overall adhesive in an amount from 25 to 95 weight percent. The polyimide base polymer has a glass transition temperature (“Tg”) in a range of from about 150 to about 300° C. and typically has a coefficient of thermal expansion above 50 ppm/° C. The polyimide based adhesives of the invention also contain an aramid micro fiber filler in an amount from 5 to 75 weight percent, based upon the total weight of the polyimide based adhesive. The fiber filler can be used to lower CTE of the overall adhesive to match (or nearly match) the CTE of other materials like metal, silicon wafers, other polymers (including polyimide) and the like.
摘要翻译： 本发明涉及具有等于或低于50ppm /℃的热膨胀系数（“CTE”）的聚酰亚胺基粘合剂。本发明的粘合剂含有总体粘合剂中聚酰亚胺基聚合物的量为25 至95重量％。 聚酰亚胺基聚合物的玻璃化转变温度（“Tg”）在约150至约300℃的范围内，并且通常具有高于50ppm /℃的热膨胀系数。本发明的聚酰亚胺基粘合剂也 基于聚酰亚胺基粘合剂的总重量，含有5至75重量％的芳族聚酰胺微纤维填料。 纤维填料可用于降低整个粘合剂的CTE以匹配（或几乎匹配）其它材料如金属，硅晶片，其它聚合物（包括聚酰亚胺）等的CTE。
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公开(公告)号：US20100319969A1
公开(公告)日：2010-12-23
申请号：US12708459
申请日：2010-02-18
CPC分类号： B32B27/12 , B32B5/26 , B32B27/04 , B32B2260/021 , B32B2262/101 , B32B2262/106 , B32B2307/202 , B32B2307/302 , B32B2457/00 , C08K3/38 , C08K9/08 , C08K2003/385 , H05K1/0206 , H05K1/0207 , H05K1/0366 , H05K1/0373 , H05K3/429 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K2201/0209 , H05K2201/0278 , H05K2201/0287 , H05K2201/0323 , Y10S428/901 , Y10T29/49124 , Y10T29/49165 , Y10T428/24917 , Y10T428/24994 , Y10T428/249942 , Y10T428/249945 , Y10T428/249946 , Y10T428/249947 , Y10T428/249951 , Y10T428/249952 , Y10T428/25 , Y10T428/292 , Y10T428/31504 , Y10T442/117 , Y10T442/2418
摘要： Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.
摘要翻译： 预浸料，层压板，印刷线路板结构以及用于构造材料和印刷线路板的工艺，其能够构造具有改善的热性能的印刷线路板。 在一个实施例中，预浸料包括浸渍有导电和导热树脂的基材。 在其它实施例中，预浸料坯具有包括碳的基底材料。 在其它实施方案中，预浸料包括浸渍有导热树脂的基材。 在其他实施例中，印刷线路板结构包括可以用作接地和/或电源平面的导电和导热的层压板。
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8.发明申请PREPREG AND ITS APPLICATION PRODUCTS FOR LOW THERMAL EXPANSION AND LOW DIELECTRIC TANGENT 有权PREPREG及其低热膨胀和低介电常数的应用产品公开(公告)号：US20090178832A1
公开(公告)日：2009-07-16
申请号：US12353357
申请日：2009-01-14
申请人： Satoru Amou , Hiroshi Shimizu , Akinori Hanawa
发明人： Satoru Amou , Hiroshi Shimizu , Akinori Hanawa
CPC分类号： H05K1/0366 , B32B3/08 , B32B3/18 , B32B5/022 , B32B5/024 , B32B15/02 , B32B15/14 , B32B15/20 , B32B17/02 , B32B2260/021 , B32B2260/046 , B32B2262/0253 , B32B2262/101 , B32B2307/202 , B32B2307/204 , B32B2307/306 , B32B2307/714 , B32B2457/00 , B32B2457/04 , B32B2457/08 , H05K3/4069 , H05K3/4652 , H05K2201/012 , H05K2201/0133 , H05K2201/0278 , H05K2201/068 , Y10T442/2475
摘要： A prepreg comprising composite woven cloth or non-woven cloth composed of glass fiber and polyolefin fiber that are a main part of the cloth and a thermosetting resin composition that gives a cured product having a low thermal expansion coefficient, wherein the thermal expansion coefficient of the cured resin composition at 50 to 100 ° C. is 50 ppm/° C. or less. A printed circuit board, multi layered circuit board, and electronic part are disclosed.
摘要翻译： 包含作为布的主要部分的由玻璃纤维和聚烯烃纤维组成的复合织布或无纺布的预浸料，以及提供具有低热膨胀系数的固化产物的热固性树脂组合物，其中， 50〜100℃的固化树脂组合物为50ppm /℃以下。 公开了印刷电路板，多层电路板和电子部件。
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9.发明申请Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same 有权具有减少热膨胀的无卤素电路化基板，其制造方法，利用其的多层基板结构以及利用其的信息处理系统公开(公告)号：US20090175000A1
公开(公告)日：2009-07-09
申请号：US12380618
申请日：2009-03-02
CPC分类号： H05K3/4688 , H01L23/145 , H01L23/3733 , H01L23/49833 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2924/3011 , H05K1/0366 , H05K1/0373 , H05K3/4652 , H05K3/4655 , H05K2201/0209 , H05K2201/0278 , H05K2201/09309 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , H01L2224/0401
摘要： A circuitized substrate including a composite layer comprising a first dielectric sub-layer comprised of a halogen-free resin and fibers dispersed therein and a second dielectric sub-layer without fibers but also including a halogen-free resin with inorganic particulates therein. A method of making such a substrate is also provided, as is a multilayered assembly including one or more such circuitized substrates, possibly in combination with other substrates. An information handling system designed for having one or more such circuitized substrates is also provided.
摘要翻译： 一种电路化基板，包括复合层，该复合层包括由不含卤素的树脂和分散在其中的纤维构成的第一介电子层和不含纤维的第二电介质子层，并且还包括无卤素树脂和无机颗粒。 还提供了制造这种基板的方法，以及包括一个或多个这样的电路化基板的多层组件，可能与其它基板组合。 还提供了设计用于具有一个或多个这样的电路化基板的信息处理系统。
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10.发明申请Multilayered circuitized substrate with p-aramid dielectric layers and method of making same 失效具有对芳族聚酰胺介电层的多层电路基板及其制造方法公开(公告)号：US20090173426A1
公开(公告)日：2009-07-09
申请号：US12380617
申请日：2009-03-02
CPC分类号： H01L23/145 , H01L23/3733 , H01L23/3735 , H01L23/4922 , H01L23/49822 , H01L23/49827 , H01L23/564 , H01L2924/0002 , H01L2924/12044 , H05K1/0366 , H05K1/0373 , H05K3/4602 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4688 , H05K2201/0209 , H05K2201/0278 , H05K2201/068 , Y10T29/4913 , Y10T156/10 , H01L2924/00
摘要： A multilayered circuitized substrate including a plurality of dielectric layers each comprised of a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin including an inorganic filler but not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on a first of the dielectric layers. A method of making this substrate is also provided.
摘要翻译： 一种多层电路化基板，包括多个介电层，每个电介质层由浸渍有不含卤素的低吸湿性树脂的对芳族聚酰胺纸构成，所述不含卤素的低吸湿性树脂包括无机填料，但不包括连续或半连续的玻璃纤维作为其一部分， 电路层位于第一介电层上。 还提供了制造该基板的方法。
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