公开(公告)号：US11377551B2

公开(公告)日：2022-07-05

申请号：US16633018

申请日：2017-11-02

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Minshe Su ,  Zhongqiang Yang

IPC: C08L71/12 ,  B32B15/08 ,  B32B27/28 ,  C08G79/04 ,  C08J5/24 ,  C08K5/5313 ,  C08L43/02 ,  C08J5/04

Abstract: Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and a polyphenylene ether resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the polyphenylene ether resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.

公开(公告)号：US11744013B2

公开(公告)日：2023-08-29

申请号：US15841439

申请日：2017-12-14

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Minshe Su ,  Duye Li ,  Shanyin Yan ,  Qianfa Liu ,  Zhongqiang Yang

IPC: H05K1/03 ,  B32B17/02 ,  B32B25/16 ,  B32B5/26 ,  C08J5/24 ,  H05K1/02

CPC classification number: H05K1/0373 ,  B32B5/26 ,  B32B17/02 ,  B32B25/16 ,  C08J5/244 ,  C08J5/249 ,  H05K1/0237 ,  H05K1/0366 ,  B32B2262/101 ,  B32B2307/204 ,  C08J2300/24 ,  C08J2325/10 ,  C08J2400/26 ,  C08J2423/16 ,  H05K2201/0154 ,  H05K2201/0278 ,  H05K2201/068

Abstract: The present invention relates to a composite, a high-frequency circuit substrate prepared therefrom and a process for preparing the same. Such composite includes (1) from 20 to 70 parts by weight of a thermosetting mixture, including (A) a thermosetting resin based on polybutadiene or a copolymer resin of polybutadiene and styrene having a molecular weight of 11,000 or less, being composed of carbon and hydrogen elements and containing 60% or more of vinyl groups, and (B) an ethylene-propylene rubber having a weight-average molecular weight of greater than 100,000 and less than 150,000 and a number-average molecular weight of greater than 60,000 and less than 100,000 and being in a solid state at room temperature; (2) from 10 to 60 parts by weight of a glass fiber cloth; (3) from 0 to 70 parts by weight of a powder filler; and (4) from 1 to 3 parts by weight of a curing initiator. The composite of the present invention has good solvent solubility and good process operability. The high-frequency circuit substrate made by using the composite has good high frequency dielectric properties and better thermal oxidative aging performance.

公开(公告)号：US20140377534A1

公开(公告)日：2014-12-25

申请号：US14368437

申请日：2011-12-29

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Minshe Su ,  Qianfa Liu

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/03

CPC classification number: H05K1/0271 ,  B32B3/20 ,  B32B15/08 ,  B32B27/20 ,  B32B27/281 ,  B32B27/283 ,  B32B27/285 ,  B32B27/302 ,  B32B27/32 ,  B32B27/322 ,  B32B27/36 ,  B32B27/38 ,  B32B27/42 ,  B32B2264/0257 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/105 ,  B32B2264/108 ,  B32B2307/704 ,  B32B2307/734 ,  B32B2457/00 ,  H05K1/0306 ,  H05K3/022 ,  H05K3/386 ,  H05K3/4611 ,  H05K2201/0137 ,  Y10T156/1056 ,  Y10T428/249982 ,  Y10T428/249985

Abstract: A circuit substrate, including a porous glass film with the volume percentage ratio of the glass being above 45%, a resin adhesion layer located on either side of the glass film respectively, and a metal foil located in the outside of resin adhesion layer. The glass film, the resin adhesion layer and the metal foil join together through suppressing, and the resin of the resin adhesion layer is filled in the gaps of the glass film. The circuit substrate employs a porous glass film as a carrier material, so that the resin adhesion layer and the surface of the glass film surface have a good binding force, and the CTE of the circuit substrate in the direction of X and Y is reduced compared to instances before, and has good formability, which is simple and convenient in process operation. In addition, also provided is a manufacturing method for a circuit substrate.

Abstract translation: 电路基板包括玻璃的体积比率高于45％的多孔玻璃膜，分别位于玻璃膜两侧的树脂粘合层和位于树脂粘合层外侧的金属箔。 通过抑制将玻璃膜，树脂粘合层和金属箔接合在一起，树脂粘合层的树脂填充在玻璃膜的间隙中。 电路基板采用多孔玻璃膜作为载体材料，使得树脂粘附层和玻璃膜表面的表面具有良好的结合力，并且电路基板在X和Y方向上的CTE减小了比较 以前的实例，具有良好的可加工性，这在过程操作中简单方便。 此外，还提供了一种用于电路基板的制造方法。

公开(公告)号：US11319397B2

公开(公告)日：2022-05-03

申请号：US16633012

申请日：2017-11-02

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Minshe Su ,  Zhongqiang Yang

IPC: C08F279/02 ,  C08F299/02 ,  B32B15/08 ,  C08J5/24 ,  C08K3/36 ,  H05K1/02 ,  H05K1/03 ,  C08F222/40

Abstract: Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and another thermosetting resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the other thermosetting resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.