FLEXIBLE DISPLAY PANEL AND FLEXIBLE ARRAY SUBSTRATE

    公开(公告)号:US20240049523A1

    公开(公告)日:2024-02-08

    申请号:US17623501

    申请日:2021-12-20

    IPC分类号: H10K59/124

    CPC分类号: H10K59/124

    摘要: A flexible display panel and a flexible array substrate are provided, which include a flexible substrate, a thin film transistor layer, and an organic planarization layer. The thin film transistor layer is disposed on the flexible substrate and in a display area and includes a plurality of insulating layers disposed in a stack, wherein, a surface of the thin film transistor layer away from the flexible substrate is provided with first through-holes penetrating at least one of the insulating layers. The organic planarization layer covers one side of the thin film transistor layer away from the flexible substrate and is filled in the first through-holes.

    Ink jet printing organic light emitting diode display panel and manufacturing method thereof

    公开(公告)号:US10985226B2

    公开(公告)日:2021-04-20

    申请号:US16009569

    申请日:2018-06-15

    摘要: Provided are an ink jet printing organic light emitting diode display panel and a manufacturing method thereof. The method includes: sequentially forming a passivation layer and a planarization layer on a carrier substrate prepared with one pair of thin film transistors, wherein the passivation layer covers the one pair of thin film transistors; forming one pair of vias in the passivation layer and the planarization layer; forming one pair of anodes on the planarization layer, wherein the one pair of anodes are electrically connected to the one pair of thin film transistors through the one pair of vias in the passivation layer and the planarization layer; preparing an electrode separation layer between the one pair of anodes with Al2O3 or an organic photoresist material; forming a light emitting layer over the one pair of anodes by ink jet printing, wherein the light emitting layer covers the electrode separation layer.

    Display panel and manufacturing method thereof

    公开(公告)号:US12080543B2

    公开(公告)日:2024-09-03

    申请号:US17622617

    申请日:2021-12-16

    IPC分类号: H01L27/12 H01L23/532

    摘要: A display panel includes a substrate, a first metal layer, and a first insulating layer, an oxide semiconductor layer, a second insulating layer, a second metal layer, a third insulating layer, and a third metal layer stacked on each other sequentially. The first insulating layer includes a first region and a second region adjacent to the first region, and a thickness of the second region is less than a thickness of the first region. A projection of at least a portion of the oxide semiconductor layer projected on the substrate overlaps with a projection of the first metal layer projected on the substrate. The third metal layer is connected to the first metal layer through a third via hole, and the third via hole is extended through the first insulating layer and the third insulating layer.

    THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20240047538A1

    公开(公告)日:2024-02-08

    申请号:US17419588

    申请日:2021-05-10

    摘要: The present application provides a thin film transistor and a manufacturing method thereof. A substrate, an active layer, a first insulating layer, and a gate electrode are stacked and disposed in sequence, the second insulating layer is disposed on the substrate and covers the active layer, the first insulating layer, and the gate electrode. A source electrode and a drain electrode are separately disposed on a side of the second insulating layer away from the gate electrode, and any one of a projection of the source electrode on the active layer or a projection of the drain electrode on the active layer does not coincide with a projection of the gate electrode on the active layer. Thereby, a parasitic capacitance of the gate electrode and the source electrode can be reduced, and a parasitic capacitance of the gate electrode and the drain electrode can be reduced.