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公开(公告)号：US20210054192A1
公开(公告)日：2021-02-25
申请号：US16977719
申请日：2019-01-21
Applicant: SHOWA DENKO K.K.
Inventor： Ryujin ISHIUCHI , Nobuyuki TAKAHASHI
Abstract: Provided are: a resin composition for easily giving polishing pads which have a hardness suitable for chemical mechanical polishing and have voids of a desired size; a polishing pad produced from the resin composition; and a method for producing the polishing pad. The resin composition comprises a urethane (meth)acrylate (A), at least one unsaturated resin (B) selected from among vinyl ester resins and unsaturated polyester resins, an ethylenically unsaturated compound (C) which has an ethylenically unsaturated bond and is neither the urethane (meth)acrylate (A) nor the unsaturated resin (B), and a hollow object (D), wherein the mass ratio of the content of the urethane (meth)acrylate (A) to the content of the unsaturated resin (B), A:B, is 64:36 to 96:4 and the content of the hollow object (D) is 0.7-9.0 parts by mass per 100 parts by mass of the sum of the urethane (meth)acrylate (A), the unsaturated resin (B), and the ethylenically unsaturated compound (C).
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公开(公告)号：US20190169468A1
公开(公告)日：2019-06-06
申请号：US16304350
申请日：2017-06-09
Applicant: SHOWA DENKO K.K.
Inventor： Ryohei ITO , Tsunehiko NISHIMURA , Akifumi TAMURA , Nobuyuki TAKAHASHI
IPC: C09J4/06 , C09J109/02 , C09J133/10 , C09J11/04 , C09J11/06
Abstract: A radical-curable adhesive composition containing a rubber (a) having one or more (meth)acryloyl groups within a single molecular chain, a polymerizable monomer (b) having both an epoxy group and a (meth)acryloyloxy group in the molecule, and a radical polymerization initiator (c). The rubber (a) is preferably a polymer of a monomer containing at least acrylonitrile.
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公开(公告)号：US20220154009A1
公开(公告)日：2022-05-19
申请号：US17595957
申请日：2020-08-03
Applicant: SHOWA DENKO K.K.
Inventor： Kazuo OTANI , Shinji NUMAO , Nobuyuki TAKAHASHI , Ryota NIIBAYASHI
IPC: C09D5/00 , C09D123/26 , C09D171/12
Abstract: A primer-attached thermoplastic resin material having a thermoplastic resin material and one or plural primer layers laminated on the thermoplastic resin material, wherein at least one layer of the primer layers is a layer derived from a film.
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Patent Agency Ranking
公开(公告)号：US20220219403A1
公开(公告)日：2022-07-14
申请号：US17615320
申请日：2020-08-03
Applicant: SHOWA DENKO K.K.
Inventor： Kazuo OTANI , Shinji NUMAO , Nobuyuki TAKAHASHI , Ryota NIIBAYASHI
Abstract: A primer-attached thermoplastic resin material having a thermoplastic resin material and one or plural primer layers laminated on the thermoplastic resin material, wherein at least one layer of the primer layers is an in-situ polymerizable composition layer of an in-situ polymerizable composition polymerized on the thermoplastic resin material.
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5.发明申请公开(公告)号：US20170263233A1
公开(公告)日：2017-09-14
申请号：US15531477
申请日：2015-12-11
Applicant: SHOWA DENKO K.K.
Inventor： Nobuyuki TAKAHASHI , Ryujin ISHIUCHI , Shotaro ITAMI
IPC: G10K11/165 , E01F8/00 , E04B1/86
CPC classification number: G10K11/165 , B29C39/003 , B29K2031/00 , B29K2067/06 , B29K2509/14 , B29K2995/0002 , E01F8/0005 , E01F8/0029 , E04B1/86
Abstract: This invention is concerning a structure body containing inorganic particles having an average particle diameter of 6 mm to 50 mm, and 6 parts by mass to 40 parts by mass of a resin with respect to 100 parts by mass of the inorganic particles.
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公开(公告)号：US20240051237A1
公开(公告)日：2024-02-15
申请号：US18268036
申请日：2021-11-09
Applicant: SHOWA DENKO K.K.
Inventor： Nobuyuki TAKAHASHI , Masahiro SATO , Kazuo OTANI
IPC: B29C65/00
CPC classification number: B29C66/742 , B29C66/71
Abstract: Provided is a method for easily manufacturing a metal-polyolefin bonded body having high bonding strength. This method for manufacturing a metallic member-resin member bonded body comprises: preparing a film that includes at least one modified polyolefin layer selected from the group consisting of a layer containing a reaction product 1 of a maleic anhydride-modified polyolefin, a bifunctional epoxy resin, and a bifunctional phenol compound, a layer containing a reaction product 2 of a maleic anhydride-modified polyolefin and a thermoplastic epoxy resin, and a layer containing a mixture of a polyolefin and a thermoplastic epoxy resin; disposing the film on at least a part of the surface of a metallic substrate so as to expose the modified polyolefin layer, thereby forming a metallic member in which a resin coating layer is laminated on the metallic substrate; and bonding a resin member onto the resin coating layer of the metallic member.
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公开(公告)号：US20230330946A1
公开(公告)日：2023-10-19
申请号：US18042492
申请日：2021-08-04
Applicant: SHOWA DENKO K.K.
Inventor： Kazuo OTANI , Nobuyuki TAKAHASHI , Ryota NIIBAYASHI
Abstract: The present invention relates to a method for bonding a metal and a resin, including bonding a metal and a resin by high-frequency induction welding via an intermediate resin layer which causes a chemical reaction.
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公开(公告)号：US20230132089A1
公开(公告)日：2023-04-27
申请号：US17912370
申请日：2021-03-09
Applicant: SHOWA DENKO K.K.
Inventor： Kazuo OTANI , Nobuyuki TAKAHASHI
IPC: B32B15/082 , B32B38/16
Abstract: To provide a bonding technique that is capable of bonding a metal and a resin with a sufficient bonding strength. A bonded article including a functional group-carrying metal surface and a functional group-carrying resin surface, which are bonded directly to each other, the functional group-carrying metal surface having one or more kind of a functional group selected from the group consisting of an amino group, an epoxy group, a mercapto group, a styryl group, a (meth)acryloyl group, an isocyanato group, and an alkenyl group, on a surface of a metal, the functional group-carrying resin surface having one or more kind of a functional group selected from the group consisting of an amino group, an epoxy group, a mercapto group, a styryl group, a (meth)acryloyl group, an isocyanato group, and an alkenyl group, on a surface of a resin.
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