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公开(公告)号：US20240421770A1
公开(公告)日：2024-12-19
申请号：US18337278
申请日：2023-06-19
Applicant: Silicon Laboratories Inc.
Inventor： Mustafa Koroglu , John Khoury , Yan Zhou , Ajmal Vadakkan Kayyil , Vitor Pereira
Abstract: In one embodiment, an apparatus includes: a wake-up radio to issue a trigger signal in response to detection of a wake-up message in a radio frequency (RF) signal; and a second radio coupled to the wake-up radio, the second radio to wake up in response to receipt of the trigger signal. The wake-up radio may be coupled to the second radio without substantial loading, and may be configured with stacked circuits to reuse currents.
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公开(公告)号：US20240022268A1
公开(公告)日：2024-01-18
申请号：US18474395
申请日：2023-09-26
Applicant: Silicon Laboratories Inc.
Inventor： Euisoo Yoo , Arup Mukherji , Rangakrishnan Srinivasan , Vitor Pereira , Zhongda Wang , Sriharsha Vasadi
CPC classification number: H04B1/0064 , H03F3/195 , H03H7/38 , H03F2200/451 , H03F2200/294
Abstract: In one embodiment, an integrated circuit includes: a first radio frequency (RF) circuit configured to receive and process a first RF signal having a sub-gigahertz (GHz) frequency to output a first lower frequency signal and to transmit RF signals having the sub-GHz frequency; a second RF circuit configured to receive and process a second RF signal having a frequency of at least substantially 2.4 GHz to output a second lower frequency signal and to transmit RF signals at the at least substantially 2.4 GHz; shared analog circuitry coupled to the first RF circuit and the second RF circuit, the shared analog circuitry to receive at least one of the first RF signal or the second RF signal and output a digital output signal; and a digital circuit coupled to the shared analog circuit, the digital circuit to recover message information from the digital output signal.
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公开(公告)号：US20220399869A1
公开(公告)日：2022-12-15
申请号：US17892492
申请日：2022-08-22
Applicant: Silicon Laboratories Inc.
Inventor： Vitor Pereira , Jeffrey A. Tindle , Mustafa H. Koroglu , Terry Lee Dickey
Abstract: A wireless transceiver including a receiver circuit coupled to an RF transceiver node, a tunable notch filter coupled between the RF transceiver node and a reference node, and a controller that programs the tunable notch filter with a selected blocker frequency and that selectively enables the tunable notch filter to attenuate at least one blocker signal. The tunable notch filter may include a variable capacitor and an inductor coupled in series between the RF transceiver node and ground. The inductor of the tunable notch filter may include a bondwire coupled between a semiconductor die and a semiconductor package. The inductance may include a physical inductor mounted on the package or a printed circuit board. The tunable notch filter may be enabled by a switch selectively coupling the filter to either the RF transceiver node or ground. The variable capacitor may be digitally programmed with digital values stored in a memory.
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公开(公告)号：US11973481B2
公开(公告)日：2024-04-30
申请号：US17537075
申请日：2021-11-29
Applicant: Silicon Laboratories Inc.
Inventor： Vitor Pereira , Jeffrey A. Tindle , Mustafa H. Koroglu , Terry Lee Dickey
CPC classification number: H03H7/0115 , H03H7/0153 , H04B1/0458 , H04B1/18 , H04B1/40 , H03H2007/013
Abstract: A wireless transceiver including a receiver circuit coupled to an RF transceiver node, a tunable notch filter coupled between the RF transceiver node and a reference node, and a controller that programs the tunable notch filter with a selected blocker frequency and that selectively enables the tunable notch filter to attenuate at least one blocker signal. The tunable notch filter may include a variable capacitor and an inductor coupled in series between the RF transceiver node and ground. The inductor of the tunable notch filter may include a bondwire coupled between a semiconductor die and a semiconductor package. The inductance may include a physical inductor mounted on the package or a printed circuit board. The tunable notch filter may be enabled by a switch selectively coupling the filter to either the RF transceiver node or ground. The variable capacitor may be digitally programmed with digital values stored in a memory.
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公开(公告)号：US20230208368A1
公开(公告)日：2023-06-29
申请号：US18175593
申请日：2023-02-28
Applicant: Silicon Laboratories Inc.
Inventor： Ruifeng Sun , Sherry Wu , Michael S. Johnson , Vitor Pereira
CPC classification number: H03F3/245 , H03F1/0233 , H04B1/04 , H04L27/12 , H04B2001/0408 , H03F2200/105 , H03F2200/451
Abstract: In one embodiment, a dual-mode power amplifier that can operate in different modes includes: a first pair of metal oxide semiconductor field effect transistors (MOSFETs) to receive and pass a constant envelope signal; a second pair of MOSFETs to receive and pass a variable envelope signal, where first terminals of the first pair of MOSFETs are coupled to first terminals of the second pair of MOSFETs, and second terminals of the first pair of MOSFETs are coupled to. second terminals of the second pair of MOSFETs; and a shared MOSFET stack coupled to the first pair of MOSFETs and the second pair of MOSFETs.
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Patent Agency Ranking
公开(公告)号：US11646705B2
公开(公告)日：2023-05-09
申请号：US17363049
申请日：2021-06-30
Applicant: Silicon Laboratories Inc.
Inventor： Ruifeng Sun , Sherry Wu , Michael S. Johnson , Vitor Pereira
CPC classification number: H03F3/245 , H03F1/0233 , H04B1/04 , H04L27/12 , H03F2200/105 , H03F2200/451 , H04B2001/0408
Abstract: In one embodiment, a dual-mode power amplifier that can operate in different modes includes: a first pair of metal oxide semiconductor field effect transistors (MOSFETs) to receive and pass a constant envelope signal; a second pair of MOSFETs to receive and pass a variable envelope signal, where first terminals of the first pair of MOSFETs are coupled to first terminals of the second pair of MOSFETs, and second terminals of the first pair of MOSFETs are coupled to. second terminals of the second pair of MOSFETs; and a shared MOSFET stack coupled to the first pair of MOSFETs and the second pair of MOSFETs.
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公开(公告)号：US11190147B1
公开(公告)日：2021-11-30
申请号：US16904821
申请日：2020-06-18
Applicant: Silicon Laboratories Inc.
Inventor： Mustafa Koroglu , Luigi Panseri , Yu Su , Vitor Pereira
Abstract: In one embodiment, an apparatus includes: a digital baseband circuit to receive a digital baseband signal and output a first digital baseband signal and a second digital baseband signal, the second digital baseband signal comprising a scaled version of the first digital baseband signal; a first transmitter signal path coupled to the digital baseband circuit to process the first digital baseband signal and output a first radio frequency (RF) signal; a second transmitter signal path coupled to the digital baseband circuit to process the second digital baseband signal and output a second RF signal; a first power amplifier coupled to the first transmitter signal path to amplify the first RF signal and output an amplified first RF signal; and a second power amplifier coupled to the second transmitter signal path to amplify the second RF signal and output an amplified second RF signal.
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公开(公告)号：US20210175855A1
公开(公告)日：2021-06-10
申请号：US16705868
申请日：2019-12-06
Applicant: Silicon Laboratories Inc.
Inventor： Rangakrishnan Srinivasan , Mustafa H. Koroglu , Zhongda Wang , Francesco Barale , Abdulkerim L. Coban , John M. Khoury , Sriharsha Vasadi , Michael S. Johnson , Vitor Pereira
Abstract: A transmitter including a frequency synthesizer with a voltage-controlled oscillator that provides an oscillating signal, a programmable delay circuit that delays the oscillating signal to provide a delayed oscillating signal, a power amplifier that is configured to use the delayed oscillating signal for transmitting a signal, and a delay controller that programs the delay circuit with a delay time that reduces interference caused by coupling from the power amplifier to the voltage-controlled oscillator. The delay circuit may be programmed to reduce control voltage change of the voltage-controlled oscillator as a function of delay change, and/or to reduce phase noise degradation at an output of the transmitter as a function of delay change. The delay may be adjusted based on detected operating temperature. A calibration value may be determined at a calibration frequency, in which a frequency offset may be determined based on a selected channel frequency.
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公开(公告)号：US20200328731A1
公开(公告)日：2020-10-15
申请号：US16912652
申请日：2020-06-25
Applicant: Silicon Laboratories Inc.
Inventor： Steffen Skaug , Vitor Pereira , Arup Mukherji
IPC: H03K3/013
Abstract: An integrated circuit including a functional circuit including at least one swapping circuit node, multiple duplicate electronic circuits, and a switch circuit. The duplicate electronic circuits are integrated in close proximity with each other each including at least one electronic device that is susceptible to RTN. The switch circuit electrically couples a different selected subset of at least one of the duplicate electronic circuits to the at least one swapping circuit node for each of successive switching states during operation of the functional circuit. A method of reducing noise including selecting a subset of the duplicate electronic circuits, electrically coupling the selected duplicate electronic devices to at least one swapping circuit node of a functional circuit, and repeating the selecting and electrically coupling in successive switching states during operation of the functional circuit for different subsets of the duplicate electronic circuits.
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10.发明授权Die-to-die communication links for receiver integrated circuit dies and related methods 有权用于接收器集成电路管芯的模 - 模通信链路和相关方法公开(公告)号：US09252891B2
公开(公告)日：2016-02-02
申请号：US14575391
申请日：2014-12-18
Applicant: Silicon Laboratories Inc.
Inventor： John B. Youngblood , Guner Arslan , J. A. Bolton , Trenton J. Grale , Vitor Pereira , Jeffrey A. Tindle , David S. Trager , Yan Zhou
CPC classification number: H04B15/00
Abstract: Die-to-die communication links for receiver integrated circuit dies within multi-die systems and related methods are disclosed for radio frequency (RF) receivers. The disclosed embodiments provide die-to-die communication links that allow for direct communication of operating parameters between receiver integrated circuit dies and other integrated circuit dies within a multi-die system so that the operation of receive path circuitry can be adjusted without requiring intervention from an external host processor integrated circuit. A variety of operating parameter information can be communicated through the die-to-die communication links so that the integrated circuit dies can quickly adjust to changing signal conditions without requiring intervention by the external host processor integrated circuit.
Abstract translation: 针对射频（RF）接收机公开了用于多芯片系统内的接收机集成电路管芯的模 - 模通信链路和相关方法。 所公开的实施例提供了允许在多管芯系统内的接收器集成电路管芯与其他集成电路管芯之间的操作参数的直接通信的管芯到管芯通信链路，使得可以调整接收路径电路的操作，而无需干预 外部主机处理器集成电路。 可以通过管芯到管芯通信链路传送各种操作参数信息，使得集成电路管芯可以快速地适应不断变化的信号条件，而不需要外部主机处理器集成电路的干预。
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