公开(公告)号：US20240240084A1

公开(公告)日：2024-07-18

申请号：US18559459

申请日：2021-06-11

Applicant: STELLA CHEMIFA CORPORATION

Inventor： Yosuke YAMAZAKI ,  Kenta HORIGAMI ,  Kazuya DATE ,  Rui HASEBE ,  Keiichi NII ,  Tetsuo NISHIDA

IPC: C09K13/08 ,  H01L21/311

CPC classification number: C09K13/08 ,  H01L21/31111

Abstract: Provided are a micromachining processing agent and a micromachining processing method that enable favorable micromachining while suppressing remaining of fine particles on an object to be processed having at least a silicon-containing insulating film. The micromachining processing agent according to the present invention is a micromachining processing agent for micromachining an object to be processed having at least a silicon-containing insulating film, the micromachining processing agent containing: a compound represented by a chemical formula (1) below; hydrogen fluoride; ammonium fluoride; and water,




wherein Rf represents perfluoroalkyl group having 1 to 4 carbon atoms, and M+ represents a hydrogen ion or an ammonium ion, wherein a content of the compound is 0.001 mass % or more and 0.5 mass % or less with respect to a total mass of the micromachining processing agent, a content of the hydrogen fluoride is 0.05 mass % or more and 25 mass % or less with respect to a total mass of the micromachining processing agent, a content of the ammonium fluoride is 0.5 mass % or more and 40 mass % or less with respect to a total mass of the micromachining processing agent, and the content of the hydrogen fluoride and the content of the ammonium fluoride satisfy a relational expression (1) below:







Y
≦



-

0
.
8


⁢
X

+

4
⁢
0






(
1
)







wherein X represents a concentration (mass %) of hydrogen fluoride and Y represents a concentration (mass %) of ammonium fluoride.

公开(公告)号：US20230407178A1

公开(公告)日：2023-12-21

申请号：US18251334

申请日：2021-10-27

Applicant: STELLA CHEMIFA CORPORATION

Inventor： Kazuya DATE ,  Nodoka NAKATA ,  Rui HASEBE ,  Keiichi NII

IPC: C09K13/08 ,  H01L21/311

CPC classification number: C09K13/08 ,  H01L21/31111

Abstract: A micromachining processing agent and a micromachining processing method capable of selectively micromachining a silicon oxide film when a laminated film including at least a silicon nitride film, a silicon oxide film, and a silicon alloy film is micromachined. The micromachining processing agent is used for micromachining of a laminated film including at least a silicon oxide film, a silicon nitride film, and a silicon alloy film. The micromachining processing agent contains: (a) 0.01 to 50 mass % of hydrogen fluoride; (b) 0.1 to 40 mass % of ammonium fluoride; (c) 0.001 to 10 mass % of a water-soluble polymer; (d) 0.001 to 1 mass % of an organic compound having a carboxyl group; and (e) water as an optional component, in which the water-soluble polymer is at least one selected from a group consisting of acrylic acid, ammonium acrylate, acrylamide, styrenesulfonic acid, ammonium styrenesulfonate, and styrenesulfonic acid ester.