Image sensors
    4.
    发明授权

    公开(公告)号:US11889210B2

    公开(公告)日:2024-01-30

    申请号:US17575070

    申请日:2022-01-13

    CPC classification number: H04N25/68 H04N25/772

    Abstract: An electronic device includes a first array of image pixels having inputs coupled to first selection tracks and outputs coupled to first output tracks, a second array of test pixels having inputs coupled to second selection tracks and outputs coupled to the first output tracks, and a third array of test pixels having inputs coupled to the first selection tracks and outputs coupled to second output tracks. A processor is coupled to receive output signals on the first and second output tracks. The output signals from the test pixels of the second and third arrays are fixed at one or the other of only two values in the absence of a defect. The output signals received by the processor over the first and second output tracks are processed to determine presence or absence of a defect.

    Method for processing signals from an imaging device, and associated device

    公开(公告)号:US11272118B2

    公开(公告)日:2022-03-08

    申请号:US16595192

    申请日:2019-10-07

    Abstract: An image device has an array of pixels, each pixel having a photosensitive area, a first storage node and a second storage node. A pixel is illuminated for a first period of time, and charge accumulated on the photosensitive area of the pixel during the first period of time is stored on the first storage node of the pixel. The pixel of the array is illuminated for a second period of time, and charge accumulated on the photosensitive area during the second period of time is stored on the second storage node of the pixel. A first signal is generated based on the charge stored on the first storage node, and a second signal is generated based on the charge stored on the second storage node. The first and second signals are combined using at least one subtraction operation having the first and second signals as operands.

    Device having a 2D image sensor and depth sensor

    公开(公告)号:US10455213B2

    公开(公告)日:2019-10-22

    申请号:US15467421

    申请日:2017-03-23

    Abstract: A three dimensional (3D) device is formed from a first level and a second level that are attached together. The first level includes a backside illuminated two dimensional (2D) image sensor including an array of first pixels sensitive to visible light. The second level includes a frontside illuminated depth sensor including an array of second pixels sensitive to near infrared light. The first and second levels are attached in a manner such that radiation, in particular the near infrared light, received at the backside of the first level passes through the first level to reach the depth sensor in the second level.

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