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    COOLING OF AN ELECTRONIC DEVICE
    2.
    发明申请
    COOLING OF AN ELECTRONIC DEVICE 有权

    公开(公告)号：US20230140705A1

    公开(公告)日：2023-05-04

    申请号：US17970327

    申请日：2022-10-20

    Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

    Inventor： Younes BOUTALEB ,  Romain COFFY

    IPC: H01L23/367 ,  H01L21/52 ,  H01L23/498

    Abstract: The present description concerns an electronic device comprising an electronic chip and a package for protecting said chip, said package comprising: a substrate comprising an alternation of electrically-insulating layers and of thermally-conductive layers where at least one electrically-insulating layer comprises at least a thermally-conductive portion; and a cover made of a thermally-conductive material comprising at least one lateral portion arranged in at least one cavity formed from a first surface of said substrate.

    ELECTRONIC CIRCUIT
    6.
    发明公开
    ELECTRONIC CIRCUIT 审中-公开

    公开(公告)号：US20230164905A1

    公开(公告)日：2023-05-25

    申请号：US17982913

    申请日：2022-11-08

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Romain COFFY

    IPC: H05K1/02 ,  H05K1/14

    CPC classification number: H05K1/0212 ,  H05K1/144 ,  H05K2201/06

    Abstract: An electronic circuit includes an upper substrate and a lower substrate. An electronic integrated circuit chip is positioned between the upper and lower substrates. The chip includes contact elements coupled to the upper substrate. A first region made of a first material is arranged between the chip and a heat transfer area crossing the lower substrate. A second region filled with a second material couples the lower and upper substrates and laterally surrounds the first region. The first material has a thermal conductivity greater than a thermal conductivity of the second material.

    ELECTRONICS UNIT WITH INTEGRATED METALLIC PATTERN
    7.
    发明申请
    ELECTRONICS UNIT WITH INTEGRATED METALLIC PATTERN 有权

    公开(公告)号：US20220367330A1

    公开(公告)日：2022-11-17

    申请号：US17878436

    申请日：2022-08-01

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Romain COFFY ,  Fabien QUERCIA

    IPC: H01L23/498 ,  H01L21/48 ,  H01L23/552 ,  H01L23/66 ,  H01L23/00 ,  H01Q1/22

    Abstract: A non-conductive encapsulation cover is mounted on a support face of a support substrate to delimit, with the support substrate, an internal housing. An integrated circuit chip is mounted to the support substrate within the internal housing. A metal pattern is mounted to an internal wall of the non-conductive encapsulation cover in a position facing the support face. At least two U-shaped metal wires are provided within the internal housing, located to a side of the integrated circuit chip, and fixed at one end to the metallic pattern and at another end to the support face.

    OPTOELECTRONIC DEVICE
    8.
    发明申请
    OPTOELECTRONIC DEVICE 有权

    公开(公告)号：US20210135038A1

    公开(公告)日：2021-05-06

    申请号：US17071694

    申请日：2020-10-15

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Romain COFFY ,  Remi BRECHIGNAC ,  Jean-Michel RIVIERE

    IPC: H01L31/16 ,  H01L23/00

    Abstract: An optoelectronic device includes an emitter of light rays and a receiver of light rays. The emitter is encapsulated in a transparent block. An opaque conductive layer is applied to a top surface and a side surface of the transparent block. The receiver is mounted to the opaque conductive layer at the top surface. An electrical connection is made between the receiver and the opaque conductive layer. A conductive strip is also mounted to the side surface of the transparent block and isolated from the opaque conductive layer. A further electrical connection is made between the receiver and the conductive strip.

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