公开(公告)号：US20180238753A1

公开(公告)日：2018-08-23

申请号：US15894770

申请日：2018-02-12

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Mohammad ABBASI GAVARTI ,  Daniele CALTABIANO ,  Andrea PICCO ,  Anna Angela POMARICO ,  Giuditta ROSELLI ,  Francesco BRAGHIN

IPC: G01L1/18 ,  H01C10/10 ,  H01C17/00 ,  G01L9/06

Abstract: A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer is arranged between the front surface of the sensor die and the bottom surface of the cap die, patterned to define a groove traversing its entire thickness along the vertical direction; the piezoresistive elements are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied to the front surface of the cap die and/or bottom surface of the sensor die along the vertical direction into a planar stress distribution at the groove, acting in the horizontal plane.

公开(公告)号：US20200319040A1

公开(公告)日：2020-10-08

申请号：US16904123

申请日：2020-06-17

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Mohammad ABBASI GAVARTI ,  Daniele CALTABIANO ,  Andrea PICCO ,  Anna Angela POMARICO ,  Giuditta ROSELLI ,  Francesco BRAGHIN

IPC: G01L1/18 ,  G01L9/06 ,  G01L19/14 ,  G01L9/00 ,  G01L1/26 ,  H01C10/10 ,  H01C17/00

Abstract: A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer is arranged between the front surface of the sensor die and the bottom surface of the cap die, patterned to define a groove traversing its entire thickness along the vertical direction; the piezoresistive elements are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied to the front surface of the cap die and/or bottom surface of the sensor die along the vertical direction into a planar stress distribution at the groove, acting in the horizontal plane.

公开(公告)号：US20180172725A1

公开(公告)日：2018-06-21

申请号：US15884019

申请日：2018-01-30

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Giuditta ROSELLI ,  Michele TRONCONI ,  Fabio PASOLINI

IPC: G01P15/125 ,  G06F1/16 ,  G01P13/00 ,  G01P15/08 ,  G06F3/01 ,  G06F3/038 ,  G06F13/24

CPC classification number: G01P15/125 ,  G01P13/00 ,  G01P15/0802 ,  G06F1/1613 ,  G06F1/1684 ,  G06F3/017 ,  G06F3/0383 ,  G06F13/24 ,  G06F2200/1636 ,  G06F2200/1637

Abstract: A sensor device for an electronic apparatus is provided with: a sensing structure generating a first detection signal; and a dedicated integrated circuit, connected to the sensing structure, detecting, as a function of the first detection signal, a first event associated to the electronic apparatus and generating a first interrupt signal upon detection of the first event. The dedicated integrated circuit detects the first event as a function of a temporal evolution of the first detection signal, and in particular as a function of values assumed by the first detection signal within one or more successive time windows, and of a relation between these values.

公开(公告)号：US20160091527A1

公开(公告)日：2016-03-31

申请号：US14957118

申请日：2015-12-02

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Giuditta ROSELLI ,  Michele TRONCONI ,  Fabio PASOLINI

IPC: G01P15/125 ,  G01P15/08

CPC classification number: G01P15/125 ,  G01P13/00 ,  G01P15/0802 ,  G06F1/1613 ,  G06F1/1684 ,  G06F3/017 ,  G06F3/0383 ,  G06F13/24 ,  G06F2200/1636 ,  G06F2200/1637

Abstract: A sensor device for an electronic apparatus is provided with: a sensing structure generating a first detection signal; and a dedicated integrated circuit, connected to the sensing structure, detecting, as a function of the first detection signal, a first event associated to the electronic apparatus and generating a first interrupt signal upon detection of the first event. The dedicated integrated circuit detects the first event as a function of a temporal evolution of the first detection signal, and in particular as a function of values assumed by the first detection signal within one or more successive time windows, and of a relation between these values.

Abstract translation: 一种用于电子设备的传感器装置具有：产生第一检测信号的检测结构; 以及连接到感测结构的专用集成电路，根据第一检测信号检测与电子设备相关联的第一事件，并且在检测到第一事件时产生第一中断信号。 专用集成电路根据第一检测信号的时间演变检测第一事件，特别是作为在一个或多个连续时间窗内由第一检测信号所假定的值的函数，以及这些值之间的关系 。