公开(公告)号：US20230230906A1

公开(公告)日：2023-07-20

申请号：US18154638

申请日：2023-01-13

Applicant: STMICROELECTRONICS (TOURS) SAS

Inventor： Nicolas MODE ,  Ludovic FALLOURD ,  Laurent BARREAU

IPC: H01L23/498 ,  H01L23/29 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49805 ,  H01L23/49838 ,  H01L23/293 ,  H01L23/3135 ,  H01L21/486 ,  H01L21/565

Abstract: The present disclosure concerns a method of manufacturing an electronic component and the obtained component, comprising a substrate, comprising the successive steps of: depositing a first layer of a first resin activated by abrasion to become electrically conductive, on a first surface of said substrate comprising at least one electric contact and, at least partially, on the lateral flanks of said substrate; partially abrading said first layer on the flanks of said substrate.

公开(公告)号：US20200258818A1

公开(公告)日：2020-08-13

申请号：US16785956

申请日：2020-02-10

Applicant: STMicroelectronics (Tours) SAS

Inventor： Samuel MENARD ,  Laurent BARREAU

IPC: H01L23/492 ,  H01L29/747 ,  H01L23/00 ,  H01L23/14

Abstract: A vertical power component includes a semiconductor substrate, a first electrode in contact with a lower surface of the substrate, and a second electrode in contact with an upper surface of the substrate. The vertical component is mounted to a metal connection plate via a metal spacer. The metal spacer includes a lower surface soldered to the metal connection plate and an upper surface soldered to the first electrode of the vertical power component. The metal spacer is made of a same metal as the metal connection plate. A surface are of the metal spacer mounted to the first electrode is smaller than a surface area of the first electrode.