公开(公告)号：US20020040810A1

公开(公告)日：2002-04-11

申请号：US09938850

申请日：2001-08-24

Applicant: STMicroelectronics Ltd

Inventor： Brian Laffoley

IPC: H05K001/03

CPC classification number: H05K1/141 ,  H01L24/05 ,  H01L24/16 ,  H01L2224/16058 ,  H01L2224/16105 ,  H01L2224/16108 ,  H01L2224/16238 ,  H01L2924/14 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/09427 ,  H05K2201/10727 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  H01L2924/00

Abstract: A method of mounting an electronic component having at least one contact extending across a part of its undersurface may include providing a support smaller in area than the undersurface of the component and having a contact pad for connection to the contact. The contact pad may have a first portion extending across an upper surface of the support adjacent one edge and a second portion extending from the edge across a side surface of the support. The method may also include positioning the electronic component and the support with the undersurface of the component adjacent the upper surface of the support. This is done so that the first portion of the contact pad is aligned with and spaced apart from a first portion of the contact, and the second portion of the contact pad is aligned with and disposed inwardly of a second portion of the contact.

Abstract translation: 安装具有延伸穿过其下表面的一部分的至少一个触点的电子部件的方法可以包括提供比部件的下表面更小的面积的支撑件，并具有用于连接到触头的接触垫。 接触垫可以具有延伸穿过支撑件的上表面邻近一个边缘的第一部分和从边缘延伸穿过支撑件的侧表面的第二部分。 该方法还可以包括将电子部件和支撑件定位成邻近支撑件的上表面的部件的下表面。 这样做使得接触垫的第一部分与接触件的第一部分对齐并且与接触垫的第一部分间隔开，并且接触垫的第二部分与接触件的第二部分对准并设置在接触件的第二部分的内侧。

公开(公告)号：US20040203237A1

公开(公告)日：2004-10-14

申请号：US10789829

申请日：2004-02-27

Applicant: STMICROELECTRONICS LTD.

Inventor： Brian Laffoley

IPC: H01L021/302 ,  H01L021/461

CPC classification number: H05K1/141 ,  H01L24/05 ,  H01L24/16 ,  H01L2224/16058 ,  H01L2224/16105 ,  H01L2224/16108 ,  H01L2224/16238 ,  H01L2924/14 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/09427 ,  H05K2201/10727 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  H01L2924/00

Abstract: A method of mounting an electronic component having at least one contact extending across a part of its undersurface may include providing a support smaller in area than the undersurface of the component and having a contact pad for connection to the contact. The contact pad may have a first portion extending across an upper surface of the support adjacent one edge and a second portion extending from the edge across a side surface of the support. The method may also include positioning the electronic component and the support with the undersurface of the component adjacent the upper surface of the support. This is done so that the first portion of the contact pad is aligned with and spaced apart from a first portion of the contact, and the second portion of the contact pad is aligned with and disposed inwardly of a second portion of the contact.

Abstract translation: 安装具有延伸穿过其下表面的一部分的至少一个触点的电子部件的方法可以包括提供比部件的下表面更小的面积的支撑件，并具有用于连接到触头的接触垫。 接触垫可以具有延伸穿过支撑件的上表面邻近一个边缘的第一部分和从边缘延伸穿过支撑件的侧表面的第二部分。 该方法还可以包括将电子部件和支撑件定位成邻近支撑件的上表面的部件的下表面。 这样做使得接触垫的第一部分与接触件的第一部分对齐并且与接触垫的第一部分间隔开，并且接触垫的第二部分与接触件的第二部分对齐并设置在接触件的第二部分的内侧。