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公开(公告)号:US20170284630A1
公开(公告)日:2017-10-05
申请号:US15087941
申请日:2016-03-31
Applicant: SWS Warning Systems Inc.
Inventor: Steven A. Sergenese , Jerico Wong , Rainier Chua , Umer Anwer
CPC classification number: F21V5/045 , F21V7/0058 , F21V9/00 , F21V19/0025 , F21V19/0055 , F21V23/004 , F21W2111/00 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , H05K1/0209 , H05K3/341 , H05K3/3421 , H05K3/3452 , H05K3/3484 , H05K3/3494 , H05K2201/09781 , H05K2201/10106 , H05K2203/041 , H05K2203/043 , Y02P70/613
Abstract: The present disclosure describes light systems in which the intensity of base color LEDs configured to emit light within a target color region is increased using additional white LEDs and the emitted light is filtered so that a dominant portion of light passing through the filter at a particular viewing angle is within the target color region. The present disclosure also describes methods for forming a printed circuit board with an integral heat sink arrangement by depositing additional solder on solder pads that are not used to connect electronic components so that the additional solder acts as a heat sink.
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公开(公告)号:US10072817B2
公开(公告)日:2018-09-11
申请号:US15087941
申请日:2016-03-31
Applicant: SWS Warning Systems Inc.
Inventor: Steven A. Sergenese , Jerico Wong , Rainier Chua , Umer Anwer
IPC: F21V9/00 , F21V5/04 , F21V19/00 , H05K3/34 , F21Y113/13 , F21Y115/10
CPC classification number: F21V5/045 , F21V7/0058 , F21V9/00 , F21V19/0025 , F21V19/0055 , F21V23/004 , F21W2111/00 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , H05K1/0209 , H05K3/341 , H05K3/3421 , H05K3/3452 , H05K3/3484 , H05K3/3494 , H05K2201/09781 , H05K2201/10106 , H05K2203/041 , H05K2203/043 , Y02P70/613
Abstract: The present disclosure describes light systems in which the intensity of base color LEDs configured to emit light within a target color region is increased using additional white LEDs and the emitted light is filtered so that a dominant portion of light passing through the filter at a particular viewing angle is within the target color region. The present disclosure also describes methods for forming a printed circuit board with an integral heat sink arrangement by depositing additional solder on solder pads that are not used to connect electronic components so that the additional solder acts as a heat sink.
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