公开(公告)号：US10910338B2

公开(公告)日：2021-02-02

申请号：US16362076

申请日：2019-03-22

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jeonghun Go ,  Jeong-Mo Nam ,  Sangrock Yoon

IPC: H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/498

Abstract: A mounting method of an electronic device includes providing an electronic device which includes a semiconductor chip body including an upper surface, a lower surface opposite to the upper surface, and side surfaces connecting the upper surface and the lower surface, a plurality of bumps disposed on the lower surface, and an under-fill element disposed on at least one side surface. The method further includes mounting the electronic device on a printed circuit board including connecting pads formed thereon. The bumps of the semiconductor chip body are connected to the connecting pads. The method additionally includes heating the under-fill element to a predetermined temperature to form an under-fill layer between the lower surface of the semiconductor chip body and the printed circuit board.

公开(公告)号：US10276113B2

公开(公告)日：2019-04-30

申请号：US14836186

申请日：2015-08-26

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jeonghun Go ,  Hyochul Lee ,  Onsik Choi

IPC: G09G3/12 ,  G09G3/36 ,  G02F1/1345

Abstract: A display device including: a display panel; a printed circuit board (PCB) including a first substrate and a second substrate; a driving circuit disposed on the first substrate; a carrier connected between the display panel and a pad of the PCB and having a data driving integrated circuit mounted thereon; a protrusion corresponding to the pad and protruding from a side of the second substrate; and a signal line disposed in the protrusion, the first substrate, and the second substrate, the signal line for transmitting a signal from the driving circuit to the carrier.

公开(公告)号：US09949358B2

公开(公告)日：2018-04-17

申请号：US15224903

申请日：2016-08-01

Applicant: Samsung Display Co., Ltd.

Inventor： Siyoung Choi ,  Moonshik Kang ,  Jeonghun Go ,  Yongsoon Lee

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/18

CPC classification number: H05K1/0203 ,  H05K1/0201 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0373 ,  H05K1/18 ,  H05K3/46 ,  H05K2201/0116 ,  H05K2201/0187 ,  H05K2201/062 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10128

Abstract: A circuit board includes a base layer, a circuit layer disposed on the base layer, where an air gap is defined in the circuit layer, a heat blocking part disposed in the air gap, and an electronic element disposed on the circuit layer. The heat blocking part has a thermal conductivity lower than a thermal conductivity of the circuit layer.

公开(公告)号：US10276538B2

公开(公告)日：2019-04-30

申请号：US15661769

申请日：2017-07-27

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jeonghun Go ,  Jeong-Mo Nam ,  Sangrock Yoon

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: A mounting method of an electronic device includes providing an electronic device which includes a semiconductor chip body including an upper surface, a lower surface opposite to the upper surface, and side surfaces connecting the upper surface and the lower surface, a plurality of bumps disposed on the lower surface, and an under-fill element disposed on at least one side surface. The method further includes mounting the electronic device on a printed circuit board including connecting pads formed thereon. The bumps of the semiconductor chip body are connected to the connecting pads. The method additionally includes heating the under-fill element to a predetermined temperature to form an under-fill layer between the lower surface of the semiconductor chip body and the printed circuit board.

公开(公告)号：US10009999B2

公开(公告)日：2018-06-26

申请号：US15232719

申请日：2016-08-09

Applicant: Samsung Display Co., Ltd.

Inventor： Jeonghun Go ,  Hyo-chul Lee

IPC: H05K7/10 ,  H05K7/12 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K1/14 ,  H05K3/00

CPC classification number: H05K1/18 ,  H05K1/0296 ,  H05K1/111 ,  H05K1/147 ,  H05K3/0097 ,  H05K2201/09063 ,  H05K2201/09236 ,  H05K2201/09272 ,  H05K2201/10136 ,  H05K2201/10409

Abstract: Provided is a printed circuit board and a display device having the same. The printed circuit board includes a base substrate including a first outline that extends in a first direction and a second outline facing the first outline, the base substrate having a first area, a second area, and a third area successively defined thereon in the first direction and a pad part disposed on the second area. A central outline of the second outline which overlaps the second area has a stepped shape that gradually decreases in distance between the central outline and the first outline from a first point of the central outline contacting the first area to a second point of the central outline contacting the third area.

公开(公告)号：US20170202085A1

公开(公告)日：2017-07-13

申请号：US15232719

申请日：2016-08-09

Applicant: Samsung Display Co., Ltd.

Inventor： Jeonghun Go ,  Hyo-chul Lee

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/18 ,  H05K1/0296 ,  H05K1/111 ,  H05K1/147 ,  H05K3/0097 ,  H05K2201/09063 ,  H05K2201/09236 ,  H05K2201/09272 ,  H05K2201/10136 ,  H05K2201/10409

Abstract: Provided is a printed circuit board and a display device having the same. The printed circuit board includes a base substrate including a first outline that extends in a first direction and a second outline facing the first outline, the base substrate having a first area, a second area, and a third area successively defined thereon in the first direction and a pad part disposed on the second area. A central outline of the second outline which overlaps the second area has a stepped shape that gradually decreases in distance between the central outline and the first outline from a first point of the central outline contacting the first area to a second point of the central outline contacting the third area.