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公开(公告)号:US20250008731A1
公开(公告)日:2025-01-02
申请号:US18392254
申请日:2023-12-21
Applicant: Samsung Electronics Co., Ltd.
Inventor: Daehwan CHOI , Hyuk KIM , Chanju PARK
IPC: H10B43/27
Abstract: A semiconductor device includes a cell array region and a contact region; a gate stack structure groups of gate electrodes; a channel structure extending through the gate stack structure in the cell array region; and gate contact portions connected to respective gate electrodes in the contact region. At least some of the gate contact portions extend through a through gate electrode connected to a connection gate electrode at a lower end portion. The gate contact portions include contact groups extending from a first side to a second side of the gate electrodes in an extending direction. Each of the electrode groups includes an upper group on a lower group. Each of the contact groups includes a first group connected to the upper group and a second group on the second side in the extending direction, and connected to the lower group, and a number of layers of the connection gate electrodes to which the gate contact portions are connected sequentially increases as a distance from a boundary between the first group and the second group increases in the first group and the second group.
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公开(公告)号:US20240266744A1
公开(公告)日:2024-08-08
申请号:US18563132
申请日:2022-04-19
Applicant: Samsung Electronics Co., Ltd.
Inventor: Taeksun KWON , Chanju PARK , Jungi JEONG , Jungwoo SEO , Seungyoon LEE , Dongjin JUNG
CPC classification number: H01Q9/0414 , H01Q21/0006 , H01Q21/065
Abstract: A stacked patch antenna includes an upper ground plate including a first upper hole, a first feed pad provided on the upper ground plate, a first feed line extending from the first feed pad along a first direction, a lower antenna patch provided on the first feed pad, an upper antenna patch provided on the lower antenna patch, a first upper pad provided in the first upper hole, and a first upper stub protruding from a side surface of the first upper pad.
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公开(公告)号:US20240235009A9
公开(公告)日:2024-07-11
申请号:US18547977
申请日:2022-04-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Dongjin JUNG , Chanju PARK , Jungi JEONG , Taeksun KWON , Jungwoo SEO , Junhwa OH
CPC classification number: H01Q1/243 , H01Q1/38 , H01Q21/0075
Abstract: An antenna module, according to various embodiments, may comprise: a first layer including a first etching region, a first via pad disposed to be spaced apart from an edge of the first etching region, and a first via hole disposed on one surface of the first via pad; and a second layer stacked on one surface of the first layer, and including a second etching region, a plurality of second via pads disposed to be spaced apart from an edge of the second etching region, a plurality of second via holes disposed on one surface of the plurality of second via pads, and a plurality of second dividing lines electrically connecting the plurality of second via pads.
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公开(公告)号:US20230369778A1
公开(公告)日:2023-11-16
申请号:US18361369
申请日:2023-07-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jungi JEONG , Chanju PARK , Junhwa OH , Sanghyuk WI
CPC classification number: H01Q21/0025 , H01Q1/2283 , H01Q21/064 , H01Q1/243
Abstract: The disclosure relates to a 5th generation (5G) or 6th generation (6G) communication system for supporting a higher data transfer rate beyond 4th generation (4G) communication such as long-term evolution (LTE). An antenna module is provided. The antenna module includes a communication circuit, an antenna unit comprising multiple antenna elements constituting a subarray, and a network unit disposed beneath the antenna unit in multiple layers, the network unit comprising at least one transmission line configured to be branched to positions of the multiple antenna elements, a via hole extending through the multi-layer, and a stub structure disposed on an area adjacent to the via hole. The open stub structure designed on a first layer forming a ground plane, among the multiple layers, may include a first via pad disposed to be adjacent to the via hole, a first open stub extending from the first via pad in a first direction, and a first slot part configured to surround the first via pad and the first open stub. The short stub structure designed on a second layer different from the first layer having the open stub structure designed thereon may include a second via pad disposed to be adjacent to the via hole, a short stub extending from the second via pad in a second direction perpendicular to the first direction, a transformer extending from the second via pad in a third direction different from the second direction so as to be connected to the at least one transmission line, and a second slot part configured to surround at least a portion of an edge of the second via pad, the short stub, and the transformer.
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公开(公告)号:US20240136703A1
公开(公告)日:2024-04-25
申请号:US18547977
申请日:2022-04-27
Applicant: Samsung Electronics Co., Ltd.
Inventor: Dongjin JUNG , Chanju PARK , Jungi JEONG , Taeksun KWON , Jungwoo SEO , Junhwa OH
CPC classification number: H01Q1/243 , H01Q1/38 , H01Q21/0075
Abstract: An antenna module, according to various embodiments, may comprise: a first layer including a first etching region, a first via pad disposed to be spaced apart from an edge of the first etching region, and a first via hole disposed on one surface of the first via pad; and a second layer stacked on one surface of the first layer, and including a second etching region, a plurality of second via pads disposed to be spaced apart from an edge of the second etching region, a plurality of second via holes disposed on one surface of the plurality of second via pads, and a plurality of second dividing lines electrically connecting the plurality of second via pads.
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公开(公告)号:US20240120642A1
公开(公告)日:2024-04-11
申请号:US18272917
申请日:2022-01-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Chanju PARK , Junhwa OH , Sanghyuk WI , Jungi JEONG
Abstract: According to various embodiments disclosed in the present document, an antenna module and/or an electronic device including same may comprise: a communication circuit part; an antenna part stacked-up on or above the communication circuit part and comprising multiple antenna elements; and a network part disposed between the communication circuit part and the antenna part. The antenna part may comprise: at least one first subarray formed of a combination of some of the antenna elements; and at least one second subarray formed of a combination another of the antenna elements, and disposed to be point symmetric to the first subarray. The network part may comprise: a first transmission port corresponding to a transmission input terminal of the first subarray; a first reception port corresponding to a reception input terminal of the first subarray; a second transmission port corresponding to a transmission input terminal of the second subarray; and a second reception port corresponding to a reception input terminal of the second subarray. With respect to symmetric points of the first subarray and the second subarray, the first transmission port may be disposed to be point symmetric to the second reception port, and the first reception port may be disposed to be point symmetric to the second transmission port. Various other embodiments are possible.
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公开(公告)号:US20240039161A1
公开(公告)日:2024-02-01
申请号:US18361163
申请日:2023-07-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Chanju PARK , Sanghyuk WI , Dongjin JUNG , Taeksun KWON , Jungwoo SEO , Junhwa OH
CPC classification number: H01Q9/0414 , H01Q1/526 , H01Q1/2283
Abstract: The disclosure relates to a fifth generation (5G) or a sixth generation (6G) communication system for supporting a higher data transfer rate. A dual polarization patch antenna structure and an electronic device including same are provided.
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公开(公告)号:US20250007166A1
公开(公告)日:2025-01-02
申请号:US18708975
申请日:2022-11-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jungwoo SEO , Jungi JEONG , Taeksun KWON , Chanju PARK , Dongjin JUNG , Sanghyuk WI , Seungyoon LEE
Abstract: The present disclosure relates to a 5G or 6G communication system for supporting a higher data transmission rate than a 4G communication system such as LTE. An electronic device comprising an antenna module, according to an embodiment of the present disclosure, comprises: a communication module for communicating with an external electronic device; a first antenna module including a plurality of first antenna cells and first dummy cells surrounding the plurality of first antenna cells; and a controller for controlling the communication module and the first antenna module. Each of the plurality of first antenna cells may be configured to have a first size, and each of the first dummy cells may be configured to have a second size smaller than the first size.
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公开(公告)号:US20240120667A1
公开(公告)日:2024-04-11
申请号:US18275334
申请日:2022-01-27
Applicant: Samsung Electronics Co., Ltd.
Inventor: Junhwa OH , Chanju PARK , Jungi JEONG , Sanghyuk WI , Sungtae CHOI
CPC classification number: H01Q21/28 , H01Q1/243 , H01Q1/38 , H01Q21/065
Abstract: The present disclosure relates to a 5G or 6G communication system for supporting a higher data transmission rate beyond a 4G communication system such as LTE. The antenna module may comprise: a communication circuit; an antenna unit comprising a plurality of first antenna elements forming a sub-array; a feeding network unit that is disposed below the antenna unit, and is configured to provide at least one first transmission line that is branched to the positions of the plurality of first antenna elements so that the plurality of first antenna elements form the same phase; a mounting unit that is disposed below the feeding network unit, and comprises a plurality of vias such that transmit and/or receive power of the communication circuit is provided to the antenna unit; and a routing unit that is disposed between the feeding network unit and the communication circuit, and is configured to provide at least one second transmission line that extends from a position corresponding to an output end of the communication circuit to a position corresponding to an input end of the feeding network unit in at least one layer.
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公开(公告)号:US20220247087A1
公开(公告)日:2022-08-04
申请号:US17581044
申请日:2022-01-21
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jungi JEONG , Chanju PARK , Junhwa OH , Sanghyuk WI
Abstract: The disclosure relates to a 5th generation (5G) or 6th generation (6G) communication system for supporting a higher data transfer rate beyond 4th generation (4G) communication such as long-term evolution (LTE). An antenna module is provided. The antenna module includes a communication circuit, an antenna unit comprising multiple antenna elements constituting a subarray, and a network unit disposed beneath the antenna unit in multiple layers, the network unit comprising at least one transmission line configured to be branched to positions of the multiple antenna elements, a via hole extending through the multi-layer, and a stub structure disposed on an area adjacent to the via hole. The open stub structure designed on a first layer forming a ground plane, among the multiple layers, may include a first via pad disposed to be adjacent to the via hole, a first open stub extending from the first via pad in a first direction, and a first slot part configured to surround the first via pad and the first open stub. The short stub structure designed on a second layer different from the first layer having the open stub structure designed thereon may include a second via pad disposed to be adjacent to the via hole, a short stub extending from the second via pad in a second direction perpendicular to the first direction, a transformer extending from the second via pad in a third direction different from the second direction so as to be connected to the at least one transmission line, and a second slot part configured to surround at least a portion of an edge of the second via pad, the short stub, and the transformer.
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