公开(公告)号：US20240023297A1

公开(公告)日：2024-01-18

申请号：US18359208

申请日：2023-07-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jonggeun YOON ,  Sangwon KIM ,  Youngwook KIM ,  Chankyu LIM ,  Pilwon SEO ,  Jiwoo LEE

IPC: H05K7/20 ,  G09G3/20 ,  G06F3/0354 ,  G06F3/038

CPC classification number: H05K7/20963 ,  G09G3/2096 ,  G09G3/2007 ,  G06F3/03545 ,  G06F3/038 ,  G09G2320/041 ,  G09G2320/0626 ,  G09G2340/0435 ,  G09G2354/00

Abstract: An electronic device including a thermal diffusion member for reducing hot spots is provided. The electronic device includes a plurality of display driver integrated circuits (DDICs) spaced apart from each other in a non-display area of a display panel, and disposed oriented in a first direction from the display panel, a circuit board disposed in a second direction opposite to the first direction from the display panel, and including a timing controller IC (T-CON IC) disposed so as to overlap at least some of the plurality of DDICs when the display panel is viewed from the first direction, a flexible circuit board disposed at one end of the display panel, and electrically connecting the plurality of DDICs and the circuit board, and a thermal diffusion member disposed, between the circuit board and the display panel.

公开(公告)号：US20240407076A1

公开(公告)日：2024-12-05

申请号：US18798015

申请日：2024-08-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jonggeun YOON ,  Yonghee AN ,  Sungwoo LIM ,  Chankyu LIM

IPC: H05K1/02 ,  H05K9/00

Abstract: An electronic apparatus having a printed circuit board (PCB); an electronic component disposed on the PCB; a shield can that is disposed on the PCB and includes an opening facing at least a portion of the electronic component; a support structure that is disposed between the PCB and the shield can and supports the shield can; a contact member that is at least partially located in the opening and covers a portion of the electronic component; a sheet member that includes a first region corresponding to the opening and a second region other than the first region and covers the contact member and the shield can; a first heat transfer member disposed on the sheet member; a second heat transfer member disposed on the sheet member and spaced apart from the first heat transfer member; and a cover member covering the first heat transfer member and the second heat transfer member.

公开(公告)号：US20240114662A1

公开(公告)日：2024-04-04

申请号：US18529528

申请日：2023-12-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngwook KIM ,  Sungwoo LIM ,  Chankyu LIM ,  Jonggeun YOON ,  Jiwoo LEE

IPC: H05K7/20 ,  C08K7/06 ,  C09K5/14

CPC classification number: H05K7/2039 ,  C08K7/06 ,  C09K5/14 ,  C08K2201/001

Abstract: An electronic device is provided. The electronic device includes a heat generation source including a heat dissipation surface dissipating heat, a support member disposed on a lateral side of the heat dissipation surface and surrounding at least a part of the heat generation source, a heat dissipation member facing the heat dissipation surface of the heat generation source and disposed so as to cover an area in which the support member is disposed, a thermal interface material disposed between the upper part of the heat dissipation surface of a heat generation surface and the lower surface of the heat generation source, and supported by the support member, and an adhesive member disposed in the area in which the thermal interface material is supported by the support member between the thermal interface material and the heat dissipation member, and for coupling the thermal interface material and the heat dissipation member.

公开(公告)号：US20230187971A1

公开(公告)日：2023-06-15

申请号：US18105532

申请日：2023-02-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yonghee AN ,  Sangwon KIM ,  Jiyoung KIM ,  Taekeun KIM ,  Chankyu LIM ,  Jiwoo LEE

IPC: H02J50/10 ,  H02J7/00 ,  G06F3/0354 ,  G06F3/038

CPC classification number: H02J50/10 ,  H02J7/0044 ,  G06F3/03545 ,  G06F3/038

Abstract: Various embodiments disclosed in the present document relate to an electronic device capable of wirelessly charging a pen input device. According to various embodiments disclosed in the present document, provided is an electronic device comprising: a housing that accommodates an electronic component in the inner space thereof; a wireless charging coil disposed on the inner surface of the housing forming the inner space; a first magnetic body group disposed on the inner surface of the housing and aligned with the wireless charging coil in a first direction; and a magnetic field sensor, disposed to be spaced apart from the first magnetic body group by a predetermined distance, for recognizing reverse attachment of a pen input device attachable to the electronic device. Various other embodiments may be provided.

公开(公告)号：US20220349517A1

公开(公告)日：2022-11-03

申请号：US17862938

申请日：2022-07-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Pilwon SEO ,  Jonggeun YOON ,  Chankyu LIM ,  Minhyuk CHOI ,  Deokjin PARK ,  Jiwoo LEE

IPC: F16M13/00 ,  F16M11/10 ,  F16M11/18

Abstract: An electronic device is provided. The electronic device includes a transparent display which is disposed between a first frame having a first opening formed therethrough and a second frame having a second opening formed therethrough, so as to be supported by the first frame and the second frame, a housing including a first hole through which a first connection member is exposed to the outside of the electronic device and a second hole through which a second connection member is exposed to the outside of the electronic device, the housing being coupled to at least one of the first frame or the second frame, a standing member for supporting the housing at a predetermined angle so as to enable the transparent display to display information while being inclined at the predetermined angle, and a printed circuit board electrically connected to the transparent display and including a processor.