公开(公告)号：US20240407076A1

公开(公告)日：2024-12-05

申请号：US18798015

申请日：2024-08-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jonggeun YOON ,  Yonghee AN ,  Sungwoo LIM ,  Chankyu LIM

IPC: H05K1/02 ,  H05K9/00

Abstract: An electronic apparatus having a printed circuit board (PCB); an electronic component disposed on the PCB; a shield can that is disposed on the PCB and includes an opening facing at least a portion of the electronic component; a support structure that is disposed between the PCB and the shield can and supports the shield can; a contact member that is at least partially located in the opening and covers a portion of the electronic component; a sheet member that includes a first region corresponding to the opening and a second region other than the first region and covers the contact member and the shield can; a first heat transfer member disposed on the sheet member; a second heat transfer member disposed on the sheet member and spaced apart from the first heat transfer member; and a cover member covering the first heat transfer member and the second heat transfer member.

公开(公告)号：US20240114662A1

公开(公告)日：2024-04-04

申请号：US18529528

申请日：2023-12-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngwook KIM ,  Sungwoo LIM ,  Chankyu LIM ,  Jonggeun YOON ,  Jiwoo LEE

IPC: H05K7/20 ,  C08K7/06 ,  C09K5/14

CPC classification number: H05K7/2039 ,  C08K7/06 ,  C09K5/14 ,  C08K2201/001

Abstract: An electronic device is provided. The electronic device includes a heat generation source including a heat dissipation surface dissipating heat, a support member disposed on a lateral side of the heat dissipation surface and surrounding at least a part of the heat generation source, a heat dissipation member facing the heat dissipation surface of the heat generation source and disposed so as to cover an area in which the support member is disposed, a thermal interface material disposed between the upper part of the heat dissipation surface of a heat generation surface and the lower surface of the heat generation source, and supported by the support member, and an adhesive member disposed in the area in which the thermal interface material is supported by the support member between the thermal interface material and the heat dissipation member, and for coupling the thermal interface material and the heat dissipation member.