Integrated circuit devices
    1.
    发明授权

    公开(公告)号:US12288788B2

    公开(公告)日:2025-04-29

    申请号:US17410326

    申请日:2021-08-24

    Abstract: An integrated circuit device includes substrate including a fin-type active area extending on the substrate in a first direction parallel to an upper surface of the substrate, a first gate line crossing the fin-type active area on the substrate and extending in a second direction perpendicular to the first direction, a cut gate line extending in the second direction and being spaced apart from the first gate line with a first gate cut area therebetween, a second gate line extending in the second direction and being spaced apart from the cut gate line with a second gate cut area therebetween, and a power wiring disposed on the cut gate line.

Patent Agency Ranking