-
公开(公告)号:US20170310367A1
公开(公告)日:2017-10-26
申请号:US15497846
申请日:2017-04-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Se Hwan CHOI , Jung Sik PARK , Woo Sup LEE , Geon Woo KIM
IPC: H04B5/00 , H05K1/02 , H04W4/00 , H01L25/065 , G06F1/16 , H01L23/58 , H01L23/522 , H05K1/16
CPC classification number: H04B5/0031 , G06F1/1637 , G06F1/1698 , H01L23/5227 , H01L23/58 , H01L25/0655 , H01Q1/243 , H01Q1/273 , H01Q3/24 , H01Q7/00 , H01Q7/06 , H01Q21/29 , H04B5/0081 , H04B5/0087 , H04W4/80 , H05K1/028 , H05K1/0393 , H05K1/165
Abstract: An electronic device of the present disclosure is provided. The electronic device includes a housing having a first plate facing a first direction, a second plate facing a second direction, and at least one side part, between the first plate and the second plate, facing a third direction, a first conductive pattern comprising a first coil having a first axis substantially extending in the first direction or the second direction, a second conductive pattern comprising a second coil having a second axis substantially extending in the third direction, and a communication circuit connected with the first conductive pattern and the second conductive pattern.