公开(公告)号：US20170310367A1

公开(公告)日：2017-10-26

申请号：US15497846

申请日：2017-04-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Se Hwan CHOI ,  Jung Sik PARK ,  Woo Sup LEE ,  Geon Woo KIM

IPC: H04B5/00 ,  H05K1/02 ,  H04W4/00 ,  H01L25/065 ,  G06F1/16 ,  H01L23/58 ,  H01L23/522 ,  H05K1/16

CPC classification number: H04B5/0031 ,  G06F1/1637 ,  G06F1/1698 ,  H01L23/5227 ,  H01L23/58 ,  H01L25/0655 ,  H01Q1/243 ,  H01Q1/273 ,  H01Q3/24 ,  H01Q7/00 ,  H01Q7/06 ,  H01Q21/29 ,  H04B5/0081 ,  H04B5/0087 ,  H04W4/80 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/165

Abstract: An electronic device of the present disclosure is provided. The electronic device includes a housing having a first plate facing a first direction, a second plate facing a second direction, and at least one side part, between the first plate and the second plate, facing a third direction, a first conductive pattern comprising a first coil having a first axis substantially extending in the first direction or the second direction, a second conductive pattern comprising a second coil having a second axis substantially extending in the third direction, and a communication circuit connected with the first conductive pattern and the second conductive pattern.

公开(公告)号：US20150138035A1

公开(公告)日：2015-05-21

申请号：US14176465

申请日：2014-02-10

Applicant: Korea Electronics Technology Institute ,  Samsung Electronics Co., Ltd.

Inventor： Jae Sup LEE ,  Ho Jun LEE ,  Se Hwan CHOI

IPC: H01Q9/04

CPC classification number: H01Q9/0421 ,  H01Q9/045

Abstract: A microstrip patch antenna includes a via-hole pad including via-holes, a patch disposed on the via-hole pad, a feeding via-hole disposed at a side of the patch through the patch and the via-hole pad, and a shorting via-hole disposed at a side of the patch, and configured to connect the patch and a ground unit.

Abstract translation: 微带贴片天线包括通孔焊盘，其包括通孔，布置在通孔焊盘上的贴片，通过贴片和通孔焊盘设置在贴片一侧的馈电通孔，以及短路 通孔，其设置在所述贴片的一侧，并且被配置为连接所述贴片和接地单元。

公开(公告)号：US20200235463A1

公开(公告)日：2020-07-23

申请号：US16634347

申请日：2018-08-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Do Hun CHA ,  Jung Sik PARK ,  Se Hwan CHOI

IPC: H01Q1/24 ,  H01Q1/22 ,  H01Q1/38

Abstract: Disclosed is an electronic device, which includes a housing, a display that is exposed through a first region of a front surface of the housing, a first antenna radiator that is positioned within the housing, and a communication circuit that is positioned within the housing. The display includes a pixel layer including pixels and a conductive sheet layer under the pixel layer. The conductive sheet layer includes a first conductive region, a second conductive region, and a slit interposed between the first conductive region and the second conductive region. The first antenna radiator is electrically connected with the first conductive region of the conductive sheet layer. The communication circuit receives a signal in a specified frequency band through the first antenna radiator and the first conductive region. Above this, various embodiments figured out through the specification are possible.