公开(公告)号：US10678631B2

公开(公告)日：2020-06-09

申请号：US16032368

申请日：2018-07-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Hoon Shin ,  Hae-Suk Lee ,  Han-Vit Jung ,  Kyo-Min Sohn

IPC: G06F11/00 ,  G06F11/07 ,  G06F11/14 ,  G06F11/16 ,  G06F11/18 ,  G06F11/20

Abstract: A device, system, and/or method includes an internal circuit configured to perform at least one function, an input-output terminal set and a repair circuit. The input-output terminal set includes a plurality of normal input-output terminals connected to an external device via a plurality of normal signal paths and at least one repair input-output terminal selectively connected to the external device via at least one repair signal path. The repair circuit repairs at least one failed signal path included in the normal signal paths based on a mode signal and fail information signal, where the mode signal represents whether to use the repair signal path and the fail information signal represents fail information on the normal signal paths. Using the repair circuit, various systems adopting different repair schemes may be repaired and cost of designing and manufacturing the various systems may be reduced.

公开(公告)号：US09941247B2

公开(公告)日：2018-04-10

申请号：US14790451

申请日：2015-07-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hae-Suk Lee ,  Kyo-Min Sohn ,  Ho-Young Song ,  Sang-Hoon Shin ,  Han-Vit Jung

IPC: G11C11/4093 ,  H01L25/065 ,  G11C7/10

CPC classification number: H01L25/0657 ,  G11C7/1066 ,  G11C7/1069 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A memory device including a stack semiconductor device including; an upper substrate vertically stacked on a lower substrate, the upper substrate including N upper through-silicon vias (UTSV) and upper driving circuits, and the lower substrate including N lower through-silicon vias (LTSV) and lower driving circuits, wherein each one of the upper driving circuits is stagger-connected between a Kth UTSV and a (K+1)th LTSV, where ‘N’ is a natural number greater than 1, and ‘K’ is a natural number ranging from 1 to (N−1).

公开(公告)号：USRE50078E1

公开(公告)日：2024-08-13

申请号：US17546251

申请日：2021-12-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Hoon Shin ,  Hae-Suk Lee ,  Han-Vit Jung ,  Kyo-Min Sohn

IPC: G06F11/00 ,  G06F11/07 ,  G06F11/14 ,  G06F11/16 ,  G06F11/18 ,  G06F11/20

CPC classification number: G06F11/1423 ,  G06F11/0703 ,  G06F11/0793 ,  G06F11/0796 ,  G06F11/142 ,  G06F11/1616 ,  G06F11/18 ,  G06F11/2002 ,  G06F11/2017

Abstract: A device, system, and/or method includes an internal circuit configured to perform at least one function, an input-output terminal set and a repair circuit. The input-output terminal set includes a plurality of normal input-output terminals connected to an external device via a plurality of normal signal paths and at least one repair input-output terminal selectively connected to the external device via at least one repair signal path. The repair circuit repairs at least one failed signal path included in the normal signal paths based on a mode signal and fail information signal, where the mode signal represents whether to use the repair signal path and the fail information signal represents fail information on the normal signal paths. Using the repair circuit, various systems adopting different repair schemes may be repaired and cost of designing and manufacturing the various systems may be reduced.

公开(公告)号：US10296414B2

公开(公告)日：2019-05-21

申请号：US15650096

申请日：2017-07-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Hoon Shin ,  Hae-Suk Lee ,  Han-Vit Jung ,  Kyo-Min Sohn

IPC: G06F11/00 ,  G06F11/07 ,  G06F11/14 ,  G06F11/16 ,  G06F11/18 ,  G06F11/20

Abstract: A device, system, and/or method includes an internal circuit configured to perform at least one function, an input-output terminal set and a repair circuit. The input-output terminal set includes a plurality of normal input-output terminals connected to an external device via a plurality of normal signal paths and at least one repair input-output terminal selectively connected to the external device via at least one repair signal path. The repair circuit repairs at least one failed signal path included in the normal signal paths based on a mode signal and fail information signal, where the mode signal represents whether to use the repair signal path and the fail information signal represents fail information on the normal signal paths. Using the repair circuit, various systems adopting different repair schemes may be repaired and cost of designing and manufacturing the various systems may be reduced.