公开(公告)号：US09018041B2

公开(公告)日：2015-04-28

申请号：US14064467

申请日：2013-10-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Han-shin Youn ,  Yonghwan Kwon ,  YoungHoon Ro ,  Woojae Kim ,  Sungwoo Park

IPC: H01L21/58 ,  H01L23/00 ,  H01L23/498 ,  H01L25/10 ,  H01L25/16 ,  H01L21/56

CPC classification number: H01L24/03 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/48 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/50 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An example embodiment relates to a semiconductor package. The semiconductor package includes a first substrate including a first pad, a second substrate upwardly spaced apart from the first substrate and including a second pad opposite to the first pad. At least one electrode is coupled between the first pad and the second pad. The semiconductor package includes a guide ring formed at a periphery of the electrode between the first substrate and the second substrate.

Abstract translation: 示例性实施例涉及半导体封装。 半导体封装包括第一衬底，其包括第一焊盘，与第一衬底向上间隔开的第二衬底，并且包括与第一焊盘相对的第二焊盘。 至少一个电极耦合在第一焊盘和第二焊盘之间。 半导体封装包括形成在第一基板和第二基板之间的电极的周边处的引导环。