Apparatus for manufacturing integrated circuit device
    2.
    发明申请
    Apparatus for manufacturing integrated circuit device 失效
    集成电路器件制造装置

    公开(公告)号:US20040022607A1

    公开(公告)日:2004-02-05

    申请号:US10627565

    申请日:2003-07-24

    CPC classification number: H01L21/67313 H01L21/67326 H01L21/68707

    Abstract: An apparatus includes a chamber for containing a fluid, a guide seated in the chamber, and a transfer robot for loading and/or unloading a plurality of wafers to and/or from the guide. The wafers are located on the guide. The guide has a supporting member for supporting a wafer and a stopper member for preventing the wafer from being inclined over a predetermined range. The stopper member is in contact with a wafer edge disposed at a higher position than a wafer edge supported by the supporting member. A wafer guide has a stopper member to prevent adjacent wafers from being inclined and coming in contact with each other. Therefore, it is possible to suppress a poor drying such as water spots (or watermarks) produced when wafers are adhered to each other in a drying process.

    Abstract translation: 一种装置包括用于容纳流体的腔室,位于腔室中的导向器和用于将多个晶片装载和/或从该引导件卸载的传送机器人。 晶片位于导轨上。 引导件具有用于支撑晶片的支撑构件和用于防止晶片倾斜超过预定范围的止动构件。 止动构件与设置在比由支撑构件支撑的晶片边缘更高的位置处的晶片边缘接触。 晶片引导件具有阻止相邻晶片倾斜并彼此接触的止动件。 因此,可以抑制在干燥过程中晶片彼此粘附时产生的水斑(或水印)等干燥不良。

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