Electronic device including housing containing metallic materials

    公开(公告)号:US11159660B2

    公开(公告)日:2021-10-26

    申请号:US16776064

    申请日:2020-01-29

    Abstract: Electronic device including first plate including first flat surface portion facing first direction, wherein first plate forms first surface of electronic device; second plate including second flat surface portion facing second direction opposite first direction, wherein second plate forms second surface of electronic device; side member including first metal part including first metallic material and forming at least part of third surface between first surface and second surface and second metal part including second metallic material, wherein second metal part is bonded with first metal part; and display disposed between first plate and the second plate so as to be shown through the first plate, wherein the first metal part and the second metal part form an interface including the first metallic material and the second metallic material, and wherein the interface is configured to face a third direction that is perpendicular to the first direction and the second direction.

    ELECTRONIC DEVICE INCLUDING HOUSING CONTAINING METALLIC MATERIALS

    公开(公告)号:US20200252492A1

    公开(公告)日:2020-08-06

    申请号:US16776064

    申请日:2020-01-29

    Abstract: Electronic device including first plate including first flat surface portion facing first direction, wherein first plate forms first surface of electronic device; second plate including second flat surface portion facing second direction opposite first direction, wherein second plate forms second surface of electronic device; side member including first metal part including first metallic material and forming at least part of third surface between first surface and second surface and second metal part including second metallic material, wherein second metal part is bonded with first metal part; and display disposed between first plate and the second plate so as to be shown through the first plate, wherein the first metal part and the second metal part form an interface including the first metallic material and the second metallic material, and wherein the interface is configured to face a third direction that is perpendicular to the first direction and the second direction.

    SEMICONDUCTOR DEVICE
    3.
    发明申请

    公开(公告)号:US20240413161A1

    公开(公告)日:2024-12-12

    申请号:US18414223

    申请日:2024-01-16

    Abstract: A semiconductor device may include a substrate including an active pattern, a device isolation layer defining the active pattern, a channel pattern on the active pattern, a gate electrode on the channel pattern, and a first isolation pattern and a second isolation pattern penetrating the gate electrode. The first isolation pattern may be extended into the device isolation layer, and the second isolation pattern may be provided to penetrate the gate electrode and the device isolation layer and may be extended into an upper portion of the substrate. A level of a bottom surface of the second isolation pattern may be lower than a level of a bottom surface of the device isolation layer.

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