中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

8 records (took 0.013 seconds)

    Housing including metal material and electronic device including same
    1.
    发明授权
    Housing including metal material and electronic device including same 审中-公开

    公开(公告)号：US10674623B2

    公开(公告)日：2020-06-02

    申请号：US16522896

    申请日：2019-07-26

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hyunjung Jeong ,  Youngsoo Jang ,  Yunsung Ha ,  Yongwook Hwang ,  Changyoun Hwang

    IPC: H04M1/02 ,  H01M2/10 ,  H05K7/02 ,  G06F1/16 ,  G06F1/18

    Abstract: A device, a house for the device and a method are disclosed herein. The device includes a first plate, a second plate facing an opposite direction, a side member integrally formed with the second plate, surrounding a space between the first the second plate, and a mid-plate coupled to the side member, extending into the space, the side member further including an aluminum substrate layer formed between a first and second surface exposed within the space, an aluminum oxide layer formed between the first surface and the aluminum substrate layer including multiple pores, a first layer formed conformally between the first surface and the aluminum oxide layer along the multiple pores and a surface of the aluminum oxide layer, the first layer comprising titanium, and a second layer formed on the first layer as to form the first surface, the second layer comprising titanium.

    Electronic device including structure that reduces vibration in camera module
    2.
    发明授权
    Electronic device including structure that reduces vibration in camera module 有权

    公开(公告)号：US12022179B2

    公开(公告)日：2024-06-25

    申请号：US17897229

    申请日：2022-08-29

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Chiyoung Park ,  Youngsoo Jang ,  Manho Kim

    IPC: H04N23/55 ,  H04M1/02 ,  H04N23/51

    CPC classification number: H04N23/55 ,  H04M1/0216 ,  H04N23/51

    Abstract: An electronic device includes a first housing including a first surface and a second surface; a second housing including a third surface and a fourth surface; a hinge structure; a camera module disposed within the first housing; and a first magnet disposed within the second housing and facing the camera module. The camera module includes: a case including one surface facing the first surface and the another surface facing the second surface and spaced apart from the first surface; a lens assembly movable within the case; and an actuator accommodating a second magnet and including a carrier configured to move the lens assembly in a direction toward the one surface of the case or a direction toward the other surface of the case; and the first magnet limits the movement of the lens assembly by interaction with the second magnet when the electronic device is in the folding state.

    METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT INVOLVING PERFORMING AN ELECTROSTATIC DISCHARGE TEST AND ELECTROSTATIC DISCHARGE TEST SYSTEM PERFORMING THE SAME
    3.
    发明申请
    METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT INVOLVING PERFORMING AN ELECTROSTATIC DISCHARGE TEST AND ELECTROSTATIC DISCHARGE TEST SYSTEM PERFORMING THE SAME 有权

    公开(公告)号：US20220091171A1

    公开(公告)日：2022-03-24

    申请号：US17342241

    申请日：2021-06-08

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Bonggyu Kang ,  Youngsoo Jang ,  Heesu Kim

    IPC: G01R31/00 ,  G01R3/00 ,  G01R23/163 ,  G01R31/28

    Abstract: In a method of manufacturing an integrated circuit involving performing an electrostatic discharge (ESD) test, a weak frequency band is detected by sequentially radiating a plurality of first electromagnetic waves on a first test board including the integrated circuit. First peak-to-peak voltage signals are detected by sequentially radiating the plurality of first electromagnetic waves on a second test board including an electromagnetic wave receiving module. A frequency spectrum is detected by radiating a second electromagnetic wave on a housing including a third test board including the electromagnetic wave receiving module. A second peak-to-peak voltage signal is generated based on the weak frequency band, the first peak-to-peak voltage signals and the frequency spectrum. An ESD characteristic associated with an electronic system including the integrated circuit is predicted based on the second peak-to-peak voltage signal.

    Electronic device including housing containing metallic materials
    5.
    发明授权
    Electronic device including housing containing metallic materials 有权

    公开(公告)号：US11159660B2

    公开(公告)日：2021-10-26

    申请号：US16776064

    申请日：2020-01-29

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Byounghee Choi ,  Yongwook Hwang ,  Changyoun Hwang ,  Jinho Lee ,  Hyeonwoo Lee ,  Youngsoo Jang ,  Yunsung Ha ,  Junghyeon Hwang ,  Minwoo Yoo

    IPC: H04M1/02 ,  G06F1/16 ,  H05K5/04 ,  H05K5/00 ,  H05K5/02 ,  H01Q1/24

    Abstract: Electronic device including first plate including first flat surface portion facing first direction, wherein first plate forms first surface of electronic device; second plate including second flat surface portion facing second direction opposite first direction, wherein second plate forms second surface of electronic device; side member including first metal part including first metallic material and forming at least part of third surface between first surface and second surface and second metal part including second metallic material, wherein second metal part is bonded with first metal part; and display disposed between first plate and the second plate so as to be shown through the first plate, wherein the first metal part and the second metal part form an interface including the first metallic material and the second metallic material, and wherein the interface is configured to face a third direction that is perpendicular to the first direction and the second direction.

    ELECTRONIC DEVICE INCLUDING HOUSING CONTAINING METALLIC MATERIALS
    6.
    发明申请
    ELECTRONIC DEVICE INCLUDING HOUSING CONTAINING METALLIC MATERIALS 审中-公开

    公开(公告)号：US20200252492A1

    公开(公告)日：2020-08-06

    申请号：US16776064

    申请日：2020-01-29

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Byounghee Choi ,  Yongwook Hwang ,  Changyoun Hwang ,  Jinho Lee ,  Hyeonwoo Lee ,  Youngsoo Jang ,  Yunsung Ha ,  Junghyeon Hwang ,  Minwoo Yoo

    IPC: H04M1/02 ,  G06F1/16 ,  H01Q1/24 ,  H05K5/00 ,  H05K5/02 ,  H05K5/04

    Abstract: Electronic device including first plate including first flat surface portion facing first direction, wherein first plate forms first surface of electronic device; second plate including second flat surface portion facing second direction opposite first direction, wherein second plate forms second surface of electronic device; side member including first metal part including first metallic material and forming at least part of third surface between first surface and second surface and second metal part including second metallic material, wherein second metal part is bonded with first metal part; and display disposed between first plate and the second plate so as to be shown through the first plate, wherein the first metal part and the second metal part form an interface including the first metallic material and the second metallic material, and wherein the interface is configured to face a third direction that is perpendicular to the first direction and the second direction.

    Electronic device including housing and manufacturing method thereof
    7.
    发明授权
    Electronic device including housing and manufacturing method thereof 有权

    公开(公告)号：US12111688B2

    公开(公告)日：2024-10-08

    申请号：US17697170

    申请日：2022-03-17

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Byounghee Choi ,  Sunghoon Kim ,  Sungjin Park ,  Jinho Lee ,  Youngsoo Jang ,  Sanggyou Choi ,  Yongwook Hwang

    IPC: G06F1/16

    CPC classification number: G06F1/1626 ,  G06F1/1656

    Abstract: Various embodiments of the disclosure provide an electronic device including a housing having a double texture, and a method for manufacturing the same. According to various embodiments disclosed herein, there may be provided an electronic including a housing that includes a first surface having a first surface roughness, a second surface having a second surface roughness different from the first surface, and a first connection portion between the first surface and the second surface. The electronic device may further include an oxide film layer disposed on the first surface, the second surface, and the first connection portion and configured to have a substantially uniform thickness. Various other embodiments may be applied.

Patent Agency Ranking