公开(公告)号：US10185218B2

公开(公告)日：2019-01-22

申请号：US14733172

申请日：2015-06-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaeseung Chung ,  Dongouk Kim ,  Joonyong Park ,  Jihyun Bae ,  Bongsu Shin ,  Jong G. Ok ,  Ilsun Yoon ,  Sunghoon Lee ,  Sukgyu Hahm

IPC: G03F7/00

Abstract: A method of transferring a reverse pattern using an imprint process includes: preparing a master mold, where a first pattern is defined on a surface of the master mold; coating an imprint resin on the master mold to cover the first pattern; pressing the imprint resin toward the master mold using a stamp member; curing the imprint resin to form a second pattern between the master mold and the stamp member, where the second pattern has a reverse shape to a shape of the first pattern; detaching the stamp member from the master mold to separate the second pattern from the master mold; and transferring the second pattern onto a transfer substrate.

公开(公告)号：US20160054498A1

公开(公告)日：2016-02-25

申请号：US14733234

申请日：2015-06-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaeseung Chung ,  Dongouk Kim ,  Joonyong Park ,  Jihyun Bae ,  Bongsu Shin ,  Sunghoon Lee ,  Sukgyu Hahm ,  Jong G. Ok ,  Ilsun Yoon

IPC: G02B5/30 ,  B29D11/00

CPC classification number: G02B5/3058 ,  B29D11/00644 ,  B29K2101/10 ,  G03F7/0002

Abstract: A pattern structure includes a plurality of pattern structure units arranged substantially on a same plane, where each of the pattern structure units has a first surface and a second surface, which are opposite to each other, and a microstructure is defined on the first surface of each of the pattern structure units, and a flattening layer disposed on the second surface of each of the plurality of pattern structure units, where the flattening layer connects the pattern structure units with each other, and a vertical step difference exists between second surfaces of the pattern structure units.

Abstract translation: 图案结构包括基本上在同一平面上布置的多个图案结构单元，其中每个图案结构单元具有彼此相对的第一表面和第二表面，并且在第一表面上限定微结构 每个图案结构单元和布置在多个图案结构单元的每个的第二表面上的平坦化层，其中平坦化层将图案结构单元彼此连接，并且在第二表面之间存在垂直的阶差 图案结构单位。

公开(公告)号：US10007124B2

公开(公告)日：2018-06-26

申请号：US14838507

申请日：2015-08-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joonyong Park ,  Dongouk Kim ,  Jihyun Bae ,  Bongsu Shin ,  Jong G. Ok ,  Ilsun Yoon ,  Sunghoon Lee ,  Jaeseung Chung ,  Sukgyu Hahm

IPC: H01L21/311 ,  H01L21/3065 ,  G02B27/62 ,  G02B5/30 ,  G02F1/1333

CPC classification number: G02B27/62 ,  G02B5/3058 ,  G02F1/13336 ,  G02F2001/133548 ,  H01L23/544 ,  H01L2223/54426

Abstract: A master wafer includes: a plurality of unit wafers each including a pattern disposed thereon; a coupling surface defined on each of the unit wafers; and a coupling part which couples adjacent unit wafers among the plurality of unit wafers on which the coupling surface is defined, to each other.

公开(公告)号：US20160023400A1

公开(公告)日：2016-01-28

申请号：US14733172

申请日：2015-06-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaeseung Chung ,  Dongouk Kim ,  Joonyong Park ,  Jihyun Bae ,  Bongsu Shin ,  Jong G. Ok ,  Ilsun Yoon ,  Sunghoon Lee ,  Sukgyu Hahm

IPC: B29C59/16

CPC classification number: G03F7/0002

Abstract: A method of transferring a reverse pattern using an imprint process includes: preparing a master mold, where a first pattern is defined on a surface of the master mold; coating an imprint resin on the master mold to cover the first pattern; pressing the imprint resin toward the master mold using a stamp member; curing the imprint resin to form a second pattern between the master mold and the stamp member, where the second pattern has a reverse shape to a shape of the first pattern; detaching the stamp member from the master mold to separate the second pattern from the master mold; and transferring the second pattern onto a transfer substrate.

Abstract translation: 使用压印处理传送反向图案的方法包括：准备主模具，其中第一图案被限定在主模具的表面上; 在母模上涂覆压印树脂以覆盖第一图案; 使用印模部件将压印树脂压向母模; 固化压印树脂以在主模和印模构件之间形成第二图案，其中第二图案具有与第一图案的形状相反的形状; 将印模部件从主模上拆下，将第二图案与主模分离; 并将第二图案转印到转印衬底上。

公开(公告)号：US09855703B2

公开(公告)日：2018-01-02

申请号：US14724898

申请日：2015-05-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunghoon Lee ,  Dongouk Kim ,  Joonyong Park ,  Jihyun Bae ,  Bongsu Shin ,  Jaeseung Chung ,  Sukgyu Hahm ,  Jong G. Ok ,  Ilsun Yoon

IPC: B29C59/16 ,  B29C67/00 ,  G03F7/00 ,  B29C45/00

CPC classification number: B29C59/16 ,  B29C59/165 ,  B29C67/00 ,  B29C2045/0075 ,  G03F7/0002

Abstract: A method of forming a pattern by using an imprint process includes: forming an adhesion promoting layer only in a pattern formation region on a substrate; coating a resin to cover the substrate and the adhesion promoting layer; transferring a pattern of a stamp mold to the resin covering the substrate and the adhesion promoting layer, by pressing the stamp mold onto the resin; irradiating ultraviolet light onto the resin covering the substrate and the adhesion promoting layer, to cure the resin and form a pattern of the cured resin to correspond to the pattern of the stamp mold, on the substrate; and detaching the stamp mold from the substrate, to leave a portion of the cured resin pattern only on the adhesion promoting layer on the substrate and to remove a remaining portion of the cured resin pattern from the substrate.

公开(公告)号：US09658484B2

公开(公告)日：2017-05-23

申请号：US14817496

申请日：2015-08-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunghoon Lee ,  Dongouk Kim ,  Joonyong Park ,  Jihyun Bae ,  Bongsu Shin ,  Jong G. Ok ,  Ilsun Yoon ,  Jaeseung Chung ,  Sukgyu Hahm

IPC: G02F1/1335 ,  G02B5/30 ,  G03F7/00 ,  G02F1/1333

CPC classification number: G02F1/133528 ,  G02B5/3058 ,  G02F1/13336 ,  G02F2001/133548 ,  G03F7/0002

Abstract: A pattern structure includes a plurality of pattern structure units arranged on a same plane, where each of the plurality of pattern structure units includes a plurality of microstructures defined on a surface thereof and having a width of less than about 1 micrometer (μm); and a connection layer disposed between the plurality of pattern structure units and having a width of less than about 10 μm, where the connection layer connects the plurality of pattern structure units to each other.

公开(公告)号：US09784896B2

公开(公告)日：2017-10-10

申请号：US14733234

申请日：2015-06-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaeseung Chung ,  Dongouk Kim ,  Joonyong Park ,  Jihyun Bae ,  Bongsu Shin ,  Sunghoon Lee ,  Sukgyu Hahm ,  Jong G. Ok ,  Ilsun Yoon

IPC: G02B5/30 ,  G03F7/00 ,  B29D11/00 ,  B29K101/10

CPC classification number: G02B5/3058 ,  B29D11/00644 ,  B29K2101/10 ,  G03F7/0002

Abstract: A pattern structure includes a plurality of pattern structure units arranged substantially on a same plane, where each of the pattern structure units has a first surface and a second surface, which are opposite to each other, and a microstructure is defined on the first surface of each of the pattern structure units, and a flattening layer disposed on the second surface of each of the plurality of pattern structure units, where the flattening layer connects the pattern structure units with each other, and a vertical step difference exists between second surfaces of the pattern structure units.

公开(公告)号：US20160062132A1

公开(公告)日：2016-03-03

申请号：US14838507

申请日：2015-08-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joonyong Park ,  Dongouk Kim ,  Jihyun Bae ,  Bongsu Shin ,  Jong G. Ok ,  Ilsun Yoon ,  Sunghoon Lee ,  Jaeseung Chung ,  Sukgyu Hahm

IPC: G02B27/62 ,  G02F1/1335 ,  G02B5/30 ,  B29C65/48 ,  B29C65/00

CPC classification number: G02B27/62 ,  G02B5/3058 ,  G02F1/13336 ,  G02F2001/133548

Abstract: A master wafer includes: a plurality of unit wafers each including a pattern disposed thereon; a coupling surface defined on each of the unit wafers; and a coupling part which couples adjacent unit wafers among the plurality of unit wafers on which the coupling surface is defined, to each other.

Abstract translation: 主晶片包括：多个单元晶片，每个单元晶片包括设置在其上的图案; 限定在每个单元晶片上的耦合表面; 以及耦合部件，其将限定有耦合表面的多个单元晶片中的相邻单元晶片彼此连接。

公开(公告)号：US20160023399A1

公开(公告)日：2016-01-28

申请号：US14724898

申请日：2015-05-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunghoon Lee ,  Dongouk Kim ,  Joonyong Park ,  Jihyun Bae ,  Bongsu Shin ,  Jaeseung Chung ,  Sukgyu Hahm ,  Jong G. Ok ,  Ilsun Yoon

IPC: B29C59/16

CPC classification number: B29C59/16 ,  B29C59/165 ,  B29C67/00 ,  B29C2045/0075 ,  G03F7/0002

Abstract: A method of forming a pattern by using an imprint process includes: forming an adhesion promoting layer only in a pattern formation region on a substrate; coating a resin to cover the substrate and the adhesion promoting layer; transferring a pattern of a stamp mold to the resin covering the substrate and the adhesion promoting layer, by pressing the stamp mold onto the resin; irradiating ultraviolet light onto the resin covering the substrate and the adhesion promoting layer, to cure the resin and form a pattern of the cured resin to correspond to the pattern of the stamp mold, on the substrate; and detaching the stamp mold from the substrate, to leave a portion of the cured resin pattern only on the adhesion promoting layer on the substrate and to remove a remaining portion of the cured resin pattern from the substrate.

Abstract translation: 通过使用压印工艺形成图案的方法包括：仅在基板上的图案形成区域中形成粘附促进层; 涂覆树脂以覆盖基材和粘合促进层; 通过将印模模压到树脂上，将印模的图案转印到覆盖基材和粘合促进层的树脂上; 在覆盖基材和粘合促进层的树脂上照射紫外光，固化树脂并在基材上形成对应于印模的图案的固化树脂的图案; 并将印模从基板上分离出来，将一部分固化的树脂图案仅留在基板上的粘合促进层上，并从基板上除去固化的树脂图案的剩余部分。